Switch-Mode Regulator Integration in Packaged ICs

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Solution Overview

Problem

Deep sub-micron digital integrated circuits face challenges in integrating switch-mode regulators due to mismatched technologies, leading to high power dissipation and electromagnetic interference, which complicates voltage regulation and noise reduction at the semiconductor level.

Innovation Solution

A packaged integrated circuit is developed, incorporating a switch-mode regulator on a semiconductor die affixed to a multi-layer substrate, with the regulator's inductor positioned peripherally to minimize interference, and a high-frequency output filter capacitor to filter noise, allowing for efficient power conversion and reduced noise introduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If linear voltage regulators are used for voltage regulation, then voltage regulation is achieved, but power dissipation increases and power conversion efficiency decreases

Engineering Contradiction:

Improvevoltage regulationVSAvoidpower dissipation

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent transitions from linear voltage regulation to switch-mode regulation, fundamentally changing the operating parameters from continuous analog control to pulsed switching operation. This parameter change enables power conversion efficiencies of 80-95% compared to 20-50% for linear regulators, directly addressing the power dissipation issue while maintaining voltage regulation capability

Inventive Principle:

Principle #35Parameter changes

2Loss of energy

If switch-mode regulators are integrated into high density integrated circuits, then power conversion efficiency improves, but electromagnetic interference and noise increase

Engineering Contradiction:

Improvepower conversion efficiencyVSAvoidelectromagnetic interference

Core Design Contradiction:

Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the switch-mode regulator onto a separate power management integrated circuit chip, physically separating the noisy switching components from the sensitive digital logic circuits. This spatial extraction reduces electromagnetic interference and noise coupling while maintaining the high efficiency benefits of switch-mode regulation for the memory device

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an intermediary power management integrated circuit that acts as a buffer between the power source and the memory device. This intermediary chip contains the switch-mode regulator and isolates the electromagnetic interference generated during switching operations from the sensitive memory circuits, while still providing efficient power conversion

Inventive Principle:

Principle #24Intermediary (Mediator)

3Loss of energy

If switch-mode regulators are used, then power dissipation is reduced, but integration with sub-micron digital integrated circuits becomes complex

Engineering Contradiction:

Improvepower dissipationVSAvoidintegration complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent segments the integrated circuit system into distinct functional modules: a memory device chip and a separate power management integrated circuit chip. Each chip is optimized for its specific function, with the power management chip containing all switch-mode regulator components. This segmentation simplifies integration by allowing each module to be designed and manufactured independently using appropriate process technologies

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution achieves higher efficiency and reduced waste heat dissipation, addressing the need for localized, high-efficiency voltage regulation while maintaining compatibility with silicon assembly and test technologies, and effectively managing interfering voltages.

Implementation Method 1

time-varying magnetic fields produced by the inductor (410) can induce interfering voltages into nearby circuit traces (480) coupled to an integrated circuit (210)

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

A high-frequency output filter capacitor is positioned on the multi-layer substrate between an output of the switch-mode regulator and circuit elements of the integrated circuit

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentUS10103627B2Packaged integrated circuit including a switch-mode regulator and method of forming the same

Publication Date: 2018.10.16 ALTERA CORP

AI summary

A packaged integrated circuit and method of forming the same. The package integrated circuit includes an integrated circuit formed on a semiconductor die affixed to a surface of a multi-layer substrate, and a switch-mode regulator formed on the semiconductor die (or another semiconductor die) affixed to the surface of the multi-layer substrate. The integrated circuit and the switch-mode regulator are integrated within a package to form the packaged integrated circuit.