Switch Module Electrode Isolation via Via Holes
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Solution Overview
Problem
The challenge is to reduce mutual signal interference between mounting electrodes in switch modules for multi-band cellular phones while minimizing the size of the module, as existing methods face difficulties in ensuring adequate spacing and preventing short circuits.
Innovation Solution
The solution involves arranging at least one power supply electrode or control electrode between RF signal electrodes, increasing the distance between them and improving isolation characteristics, thereby reducing mutual interference and eliminating the need for ground electrodes, which allows for a smaller module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground electrodes are arranged between mounting electrodes to suppress mutual interference, then isolation characteristics improve, but the module size increases
Solution Approach 1:
The invention extracts the ground electrode from the electrode arrangement and replaces it with a via hole connected to the back surface ground. This removes the need for intermediate ground electrodes between mounting electrodes while maintaining isolation through the via hole connection to ground potential on the back surface.
Solution Approach 2:
The via hole acts as an intermediary element that provides a ground connection path without requiring physical ground electrodes between mounting electrodes on the front surface. The via hole mediates between the front surface RF signal electrodes and the back surface ground plane, enabling isolation without increasing module area.
2Area of stationary object
If spacing between mounting electrodes is reduced to decrease module size, then area decreases, but mutual signal interference increases
Solution Approach 1:
The invention extracts the ground electrode function from the front surface electrode arrangement and relocates it to the back surface through via holes. This allows mounting electrodes to be placed closer together on the front surface without requiring intermediate ground electrodes, thereby reducing module area while preventing mutual interference through the via hole ground connection.
3Device complexity
If fewer electrode types are used to reduce module complexity, then device complexity decreases, but isolation characteristics worsen
Solution Approach 1:
The via hole serves multiple functions: it acts as a ground connection path, provides isolation between mounting electrodes, and connects the front surface RF signal electrodes to the back surface ground plane. This multi-functional element reduces the need for separate ground electrodes and other isolation structures, simplifying the overall electrode arrangement while maintaining isolation characteristics.
Data Source
AI summary
A switch module includes a plurality of mounting electrodes for external connection provided on a peripheral portion of one main surface of a wiring substrate. The plurality of mounting electrodes includes a common electrode, a plurality of RF signal electrodes, a control electrode, and a power supply electrode. At least one of the power supply electrode and the control electrode is arranged between the RF signal electrodes.