Switch Pad Assembly Using Vacuum Seated Alignment Features

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Solution Overview

Problem

The manual assembly of switch pads to circuit boards is time-consuming and prone to quality control issues due to misalignment of conductive members and switch contacts, resulting from the flexible nature of switch pads, which leads to incomplete or incorrect seating of alignment features.

Innovation Solution

A method and apparatus that utilize alignment features on the switch pad and alignment apertures on the circuit board, where a pressure difference is generated to fully seat the alignment feature within the aperture, ensuring proper registration and alignment, using a holder and a vacuum source to facilitate the assembly process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual assembly of switch pad to circuit board is used, then flexibility of switch pad is maintained, but misalignment of conductive member and switch contact occurs

Engineering Contradiction:
Improveflexibility of switch padVSAvoidalignment of conductive member and switch contact
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

Alignment features act as intermediary elements between the flexible switch pad and the rigid circuit board. These alignment features include protrusions on the switch pad that fit into corresponding apertures or recesses on the circuit board, providing mechanical guidance and precise positioning during assembly while allowing the switch pad to maintain its flexible properties for operational function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If push-through details or pull-through details are added to secure switch pad, then lateral movement is prevented, but assembly complexity increases

Engineering Contradiction:
Improvestability of switch padVSAvoidstructure of switch pad
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The alignment features are merged with the existing structure of the switch pad and circuit board. The alignment protrusions are integrated into the switch pad body, and the alignment apertures are formed as part of the circuit board structure, eliminating the need for separate fastening components while achieving both mechanical stability and precise alignment.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If multiple push-through details and pull-through details are used, then misalignment is minimized, but assembly time increases

Engineering Contradiction:
Improvealignment accuracyVSAvoidassembly speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The alignment features are pre-formed as integral parts of the switch pad and circuit board structures before assembly. The alignment protrusions are molded or formed during switch pad manufacturing, and the alignment apertures are prepared during circuit board fabrication, allowing for rapid assembly without requiring multiple separate alignment operations or adjustments during the assembly process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces assembly time and improves quality control by ensuring accurate alignment and seating of alignment features, thereby enhancing the reliability of the electrical connections between switch pads and circuit boards.

Implementation Method 1

generating a pressure difference between the first side of the second component and a second side of the second component at least proximate to the at least one alignment aperture thereby fully seating the flexible alignment feature relative to and the alignment aperture

Methodology Applied
Scientific EffectPressure difference: Pressure Gradient

Implementation Method 2

using a holder and a vacuum source to facilitate the assembly process

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentEP1777718B1Method and apparatus for installing a switch pad
Publication Date: 2012.12.12 DELPHI TECHNOLOGIES INC
  • EP1777718B1 patent drawingFigure 1A~1B
  • EP1777718B1 patent drawingFigure 2A~2B
  • EP1777718B1 patent drawingFigure 2C~2D

AI summary

Methods and apparatuses are disclosed for assembling a first component, such as a switch pad, to a second component, such as a circuit board.