Switch Device With Segmented Resin Holding Member
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Solution Overview
Problem
The existing switch devices with built-in resistors for detecting open circuit or short circuit failures are costly due to the need for high heat-resistant synthetic resin materials, which increase production expenses, and manual soldering processes are time-consuming and inefficient for small-sized devices.
Innovation Solution
A switch device design where the holding wall portion is made of a heat-resistant synthetic resin material for soldering, while the bottom wall portion is made of a lower heat-resistant material, allowing for reliable resistor soldering and reducing costs, with the case and holding member integrated using laser welding for improved airtightness and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high heat-resistant synthetic resin material is used for the holding member to enable soldering of resistors, then the reliability of resistor mounting is improved, but the manufacturing cost increases
Solution Approach 1:
The holding member is divided into two distinct parts: a first holding wall portion made of heat-resistant synthetic resin material for mounting resistors, and a second holding wall portion made of less expensive material. This segmentation allows each part to use materials optimized for its specific function, reducing overall cost while maintaining reliability where needed.
Solution Approach 2:
The patent applies different material qualities to different regions of the holding member. The first holding wall portion (where resistors are mounted) uses high heat-resistant material, while the second holding wall portion uses lower-cost material. This local differentiation of material properties resolves the contradiction between reliability and cost.
2Ease of manufacture
If manual soldering is used for mounting resistors, then the manufacturing cost of materials is reduced, but the productivity decreases
Solution Approach 1:
By segmenting the holding member into heat-resistant and non-heat-resistant portions, the patent enables automated reflow soldering to be used for mounting resistors on the heat-resistant portion, while avoiding the need for expensive heat-resistant material throughout the entire holding member. This resolves the productivity-cost contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall cost of the switch device, enhances manufacturing productivity, and improves the waterproof performance by using different synthetic resin materials for various components, allowing for efficient assembly and integration without the need for expensive heat-resistant materials.
Implementation Method 1
the case and holding member integrated using laser welding
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A switch device (100, 200) includes a housing (1) having a case (K1) and a holding member (H1), a moving member (2), a biasing member (3), a movable contact (4), a common fixed contact (G5), a first switching fixed contact (15, 35), a second switching fixed contact (25, 45), extending portions (6), at least two terminal members (T8), and resistors (R9, R9a, R9b, R9c, R9d) for obtaining the resistance value between two terminal members, and fixing portions (7A, 7B) to which the resistors are soldered. The holding member includes a bottom wall portion (11) that covers the bottom of the case, and a holding wall portion (51) holding the fixing portions. The holding wall portion is formed of a first synthetic resin material having heat resistance, and the bottom wall portion is made of a second synthetic resin material having a heat distortion temperature lower than that of the first synthetic resin material. A method for manufacturing a switch device includes a first molding step (P2), a resistor mounting step (P3), and a second molding step (P4).