Redistribution Structures With Switchable Routing for Stacked Dies
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Solution Overview
Problem
Conventional structures and techniques for interconnecting vertically stacked semiconductor dies are unable to accommodate different semiconductor package designs, limiting flexibility and efficiency in semiconductor manufacturing.
Innovation Solution
The use of first and second redistribution structures on semiconductor dies, aligned in a face-to-face configuration, with interconnect structures to switch signal routing, allowing the same redistribution structure designs to be used in various package configurations such as ×4, ×8, and ×16 designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional interconnection structures are used for vertically stacked semiconductor dies, then the package footprint can be reduced, but the ability to accommodate different package designs is lost
Solution Approach 1:
The redistribution structures incorporate switchable routing capabilities that allow dynamic reconfiguration of signal paths. Different routing configurations can be selected based on the specific package design requirements, enabling the same physical structure to adapt to multiple package types (e.g., ×4, ×8, ×16 designs) without requiring separate custom designs for each configuration.
Solution Approach 2:
The redistribution structures are designed with universal functionality to support multiple package designs through a single structure. By integrating switchable routing and multiple interconnection paths, the same redistribution structure can serve different package configurations, eliminating the need for separate designs and reducing overall system complexity.
2Adaptability or versatility
If different redistribution structure designs are created for each package design, then adaptability to different package configurations is improved, but manufacturing complexity and costs increase
Solution Approach 1:
Instead of creating separate redistribution structure designs for each package configuration, the invention implements a universal redistribution structure that can be configured for different package types through switchable routing. This single multi-functional design reduces manufacturing complexity while maintaining adaptability to various package designs.
Solution Approach 2:
The redistribution structure is divided into modular segments with switchable routing paths. Each segment can be independently configured or activated based on the required package design, allowing flexible adaptation without redesigning the entire structure. This segmentation enables cost-effective manufacturing by using the same base design with configurable elements.
3Adaptability or versatility
If multiple redistribution structure designs are maintained for different package designs, then design flexibility is improved, but supply chain complexity increases
Solution Approach 1:
The invention employs a universal redistribution structure design that can serve multiple package configurations, significantly reducing supply chain complexity. By maintaining a single design platform with switchable routing capabilities rather than multiple separate designs, the manufacturing process, inventory management, and quality control are simplified, while still providing the flexibility to accommodate different package types.
Data Source
AI summary
Semiconductor devices having redistribution structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a first semiconductor die including a first redistribution structure and a second semiconductor die including a second redistribution structure. The first and second semiconductor dies can be mounted on a package substrate such that the first and second redistribution structures are aligned with each other. In some embodiments, an interconnect structure can be positioned between the first and second semiconductor dies to electrically couple the first and second redistribution structures to each other. The first and second redistribution structures can be configured such that signal routing between the first and second semiconductor dies can be altered based on the location of the interconnect structure.