Switchable Thermal Link With Variable Emissivity for Spacecraft Heat Rejection

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Solution Overview

Problem

Existing thermal management systems in spacecraft face challenges due to space constraints, weight limitations, and exposure to harmful space environments, which affect payload capacity and thermal regulation efficiency.

Innovation Solution

A switchable thermal link system with interlocking fins and variable emissivity coatings that modulate heat transfer based on temperature, allowing efficient thermal communication between components and radiators while minimizing physical contact and external exposure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If passive heat dissipation is used with a static single wall radiator, then thermal management is achieved, but the surface area is limited and cannot be increased without adding more components

Engineering Contradiction:
Improveradiator surface areaVSAvoidthermal management system complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent applies the dynamics principle by making the radiator surface area variable rather than static. The thermal link mechanically connects the radiator to the heat-generating component, allowing the radiator surface area to dynamically adjust based on thermal conditions. When thermal conditions change, the thermal link can expand or contract, thereby increasing or decreasing the effective radiator surface area without requiring additional components or complex control systems.

Inventive Principle:
Principle #15Dynamics

2Temperature

If variable emissivity coatings are applied to external radiator surfaces, then thermal control is improved, but the coatings are exposed to harmful space environment effects

Engineering Contradiction:
Improvethermal control precisionVSAvoidspace environment exposure
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies the intermediary principle by introducing the thermal link as a mediator between the heat-generating component and the radiator. The thermal link contains the variable emissivity coating, positioning it away from direct exposure to harmful space environment factors such as atomic oxygen, micrometeorites, and radiation. The thermal link transfers thermal energy from the component to the radiator while protecting the sensitive coating material.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If active thermal management systems with actuators and motors are used, then radiator surface area can be increased, but space occupation increases reducing payload capacity

Engineering Contradiction:
Improveradiator surface areaVSAvoidsystem volume
Core Design Contradiction:
Area of stationary objectVSVolume of moving object

Solution Approach 1:

The patent applies the self-service principle by designing a thermal management system that automatically adjusts its own configuration based on thermal conditions. The thermal link passively responds to temperature differences and thermal expansion/contraction forces, eliminating the need for external actuators, motors, or control systems. The system self-regulates the radiator surface area according to the thermal load, reducing volume requirements while maintaining effective heat dissipation.

Inventive Principle:
Principle #25Self-service

4Quantity of substance

If more electronics are packed into the flight vehicle, then payload capacity increases, but thermal budget constraints are violated

Engineering Contradiction:
Improveelectronics quantityVSAvoidthermal budget
Core Design Contradiction:
Quantity of substanceVSTemperature

Solution Approach 1:

The patent applies the dynamics principle by creating a dynamically adjustable thermal management system that can scale its heat dissipation capacity. The thermal link's mechanical connection allows the radiator surface area to expand or contract based on the thermal load generated by the electronics. This enables the system to accommodate higher electronics density and greater payload capacity by dynamically increasing heat rejection capability when more electronics are active, without violating thermal budget constraints.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal regulation and reduces the size, weight, and power requirements, increasing payload capacity by optimizing heat transfer and protecting internal components from space hazards.

Implementation Method 1

the one or more interlocking fins include a variable emissivity coating on a surface of the one or more interlocking fins

Methodology Applied
Scientific EffectVariable emissivity: Thermal Radiation

Implementation Method 2

the nanostructured material includes a dielectric or semi-metallic material layer, and a metal-insulator transition material layer respectively interleaved between successive dielectric layers, between successive semi-metallic material layers, or between a dielectric layer and a semi-metallic layer

Methodology Applied
Scientific EffectMetal-insulator transition:

Implementation Method 3

The first portion of the switchable thermal link and the second portion of the switchable link are in operative thermal communication with the component side and the radiator side respectively

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

the gap further comprises one or more thermal insulative spacer to keep the fins from touching

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS12545442B1Switchable thermal link
Publication Date: 2026.02.10 RAYTHEON CO
  • US12545442B1 patent drawing
  • US12545442B1 patent drawing
  • US12545442B1 patent drawing

AI summary

An apparatus for transmitting heat from a component side to a radiator side on a spacecraft includes a component side that contains a heater, an electrical component, an optional first conduction link, and a first portion of a switchable thermal link and a radiator side that includes a radiator, an optional second conduction link and a second portion of a switchable thermal link. The first portion of the switchable thermal link and the second portion of the switchable link are in operative thermal communication with the component side and the radiator side respectively. The first portion of the switchable thermal link and the second portion of the switchable thermal link are reversibly attachable and detachable. The switchable thermal link is operative to receive and radiate thermal energy from the component side to the radiator side.