Switched Voltage Sensing for Multi-Chip Interconnect Power Monitoring
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Solution Overview
Problem
Existing technologies lack the ability to efficiently monitor and manage power delivery across multiple pairs of sample points in a multi-chip packaged device, leading to inefficiencies in energy consumption and conservation.
Innovation Solution
Implementing switch circuitry to selectively couple a voltage sensor to multiple pairs of sample points in an interconnect structure, enabling the sensing of voltage differentials across these points, thereby allowing for fine-grained evaluation of power delivery at various levels, including package, IC chip, and component levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a voltage sensor is continuously connected to all sample points, then complete power delivery monitoring is achieved, but device complexity and energy consumption increase
Solution Approach 1:
The patent divides the monitoring function into discrete segments by using multiple switch circuitry units, each controlling access to specific sample points. This segmentation allows the voltage sensor to monitor different portions of the interconnect structure at different times, achieving complete coverage without requiring continuous connection to all points simultaneously, thus reducing complexity.
Solution Approach 2:
The patent implements periodic monitoring by sequentially switching the voltage sensor to different sample points through the switch circuitry. Instead of continuous monitoring of all points, the system periodically samples each point in sequence, achieving complete power delivery monitoring while minimizing the time the sensor is active and reducing energy consumption.
2Measurement precision
If multiple voltage sensors are used to monitor all sample points simultaneously, then complete power delivery evaluation is achieved, but device complexity and cost increase
Solution Approach 1:
The patent makes a single voltage sensor universal by enabling it to measure multiple different sample points through the switch circuitry. The sensor performs multiple functions by sequentially accessing different locations in the interconnect structure, eliminating the need for multiple dedicated sensors while maintaining the capability to evaluate power delivery at various levels including package, IC chip, and component levels.
Solution Approach 2:
The switch circuitry acts as an intermediary between the single voltage sensor and the multiple sample points. It mediates the connection, allowing the sensor to access different measurement points sequentially without requiring direct permanent connections to all points, thus reducing the number of sensors needed while maintaining comprehensive monitoring capability.
3Loss of information
If continuous monitoring of all sample points is performed, then complete energy consumption data is captured, but energy waste increases
Solution Approach 1:
The system performs periodic sampling of voltage at different sample points rather than continuous monitoring. The controller activates the switch circuitry and voltage sensor only when monitoring is needed, sequentially measuring each sample point and then entering a low-power state. This periodic action captures complete energy consumption data over time while minimizing the energy consumed by the monitoring system itself.
Solution Approach 2:
The controller pre-determines the monitoring sequence and activates only the necessary portions of the monitoring system at each time step. By planning the measurement sequence in advance and activating components only when needed, the system captures complete energy consumption information while avoiding continuous operation of high-power components.
Data Source
AI summary
Techniques and mechanisms for sensing a voltage difference across two interconnect structures of a multi-chip packaged device. In an embodiment, the interconnect structures provide respective voltages to each of multiple integrated circuit (IC) chips of the packaged device. Switch circuitry of the packaged device is operable to provide any of multiple modes which each switchedly couple a voltage sensor to a different respective one of various sample point pairs of the interconnect structures. Control circuitry operates the switch circuitry to selectively provide one of the multiple modes based on an indication of a workload to be performed with one or more of the IC chips. In another embodiment, the voltage sensor senses the voltages each at a respective sample point of a sample point pair which corresponds to the selected mode of the switch circuitry.