Switchgear Cooling Device with Integrated Heat Pipes
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Solution Overview
Problem
Existing cooling devices for electrical switchgear, particularly in medium or high voltage technology, face challenges in efficiently dissipating heat while maintaining a compact, lightweight, and cost-effective design with high dielectric strength.
Innovation Solution
A cooling device featuring a frame that encloses multiple cooling plates and heat pipes, where the heat pipes are coupled to both a heat-emitting component and the cooling plates, allowing heat to be efficiently transferred from the heat-emitting area to the cooling plates and released to the environment, providing electrical shielding and mechanical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling devices are used for electrical switchgear, then heat dissipation is achieved, but the design becomes bulky and heavy
Solution Approach 1:
The patent combines multiple cooling plates and heat pipes into a single integrated cooling device that attaches to the electrical switchgear. The heat pipes are integrated within the cooling plates, creating a unified structure that efficiently dissipates heat while maintaining a compact and lightweight design, thereby resolving the contradiction between heat dissipation efficiency and device weight.
2Temperature
If conventional cooling devices are used for electrical switchgear, then heat dissipation is achieved, but the design becomes complex and expensive to produce
Solution Approach 1:
The cooling device is segmented into multiple cooling plates, each equipped with its own heat pipes. This modular segmentation allows for simplified manufacturing of individual components that can be independently produced and then assembled into the complete cooling device, reducing overall production complexity and cost while maintaining effective heat dissipation across the entire structure.
3Temperature
If cooling plates are exposed without shielding, then heat dissipation surface is maximized, but dielectric strength and mechanical protection are reduced
Solution Approach 1:
The housing structure serves multiple functions simultaneously: it provides mechanical protection for the cooling plates, maintains electrical insulation (dielectric strength) in medium and high voltage environments, and supports the overall cooling device structure. This multi-functionality allows the cooling plates to have adequate heat dissipation surface area while the housing ensures reliability through protection and insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective heat dissipation with a compact and lightweight design, maintaining high dielectric strength and ease of production, while ensuring efficient cooling of heat-emitting components in medium and high voltage applications.
Implementation Method 1
a heat pipe which is coupled on the one hand to a heat-emitting portion of the cooling device and on the other hand to the cooling plates. The heat is thus transported from the heat-emitting sub-area via the hot end of the heat pipe to its cold end and thus to the cooling plates
Implementation Method 2
the working medium evaporates and transports the heat to the cold end of the heat pipe
Implementation Method 3
The working medium condenses there and transfers the heat to the heat pipe and its surroundings
Implementation Method 4
the cooling plates, from which the heat is then released to the environment
Implementation Method 5
heat is released to the environment via these
Data Source
Figure 1a~1b
Figure 2a~2b
AI summary
A cooling device (10) for an electrical switchgear assembly is described, particularly in the field of medium- or high-voltage technology. The cooling device (10) is provided with a frame (18) that defines an area in which a plurality of cooling plates (19) are arranged. The cooling device (10) is further provided with at least one heat pipe (21) that is coupled on one side to a heat-dissipating section (15) of the cooling device (10) and on the other side to the cooling plates (19).