Switching Board Vertical Through Holes Battery Temperature Measurement

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Solution Overview

Problem

Conventional switching boards for lithium secondary batteries face challenges in accurately measuring temperatures due to the heat transfer coefficient of thermal glue, leading to increased manufacturing costs and defect rates.

Innovation Solution

A switching board with vertical through holes and a heating pad on a printed circuit board, eliminating the need for thermal glue by directly transmitting heat from switching elements to a temperature detection element, ensuring accurate temperature measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If thermal glue is used to attach the temperature detection element to the switching elements, then the temperature measurement can be implemented, but the measurement precision is affected by the heat transfer coefficient of the thermal glue

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidmeasurement consistency
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent removes the thermal glue from the system by creating vertical through-holes that allow direct thermal contact between the temperature detection element and the switching elements. This extraction of the intermediary material (thermal glue) eliminates the heat transfer coefficient variability that was affecting measurement accuracy and reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The vertical through-holes act as a new intermediary structure that provides a controlled thermal path between the switching elements and the temperature detection element. This structured intermediary (the through-hole cavity) replaces the problematic thermal glue while maintaining thermal coupling and eliminating measurement variability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If thermal glue is used for temperature detection element attachment, then temperature sensing is enabled, but manufacturing costs and defect rates increase due to additional manufacturing processes

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoiddefect rate
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent combines the temperature detection element mounting process with the existing PCB fabrication process by forming vertical through-holes during standard PCB manufacturing. This merging of processes eliminates separate thermal glue application steps, reducing manufacturing complexity and associated defect rates while maintaining temperature sensing functionality.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for precise temperature detection of batteries, reducing defect rates and manufacturing costs while enhancing safety by eliminating the variability caused by heat transfer coefficients.

Implementation Method 1

a lower board having a heating pad at a position corresponding to the vertical through holes and the temperature detection element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9806385B2Switching board of novel structure, and battery module containing the same
Publication Date: 2017.10.31 LG ENERGY SOLUTION LTD
  • US9806385B2 patent drawing
  • US9806385B2 patent drawing
  • US9806385B2 patent drawing

AI summary

Disclosed herein is a switching board having switching elements for temperature measurement mounted on a printed circuit board (PCB) having a circuit electrically connected to a unit cell constituting a battery module, the switching board including an upper board having a pair of switching elements, a temperature detection element, and one or more vertical through holes, the switching elements being electrically connected to the circuit, the temperature detection element and the vertical through holes being disposed between the switching elements, and a lower board having a heating pad at a position corresponding to the vertical through holes and the temperature detection element.