Switching Device Heat Pipe Thermal Balancing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High voltage switching devices experience uneven temperature distribution due to different cross-sectional areas and current density, leading to heat dissipation issues, particularly near the nominal current contact where heat sinks are distant, causing temperature rises and potential overheating.
Innovation Solution
Incorporating a heat pipe arrangement between regions of the conductor parts within the switching device's housing filled with insulating gas, allowing for enhanced thermal conduction and convective heat dissipation by evaporating a working medium at the hot end and condensing it at the cooler end, thus improving temperature distribution and avoiding hotspots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal conduction and convective flow are used for heat dissipation, then the structure remains simple, but temperature hotspots occur and heat dissipation is insufficient
Solution Approach 1:
A heat pipe arrangement is introduced as an intermediary thermal management component between the conductor part and the housing. The heat pipe includes an evaporator in thermal contact with the conductor part, a condenser in thermal contact with the housing, and a capillary wick structure between them, enabling efficient heat transfer from hotspots to the housing without complex active cooling systems
Solution Approach 2:
The heat pipe utilizes phase transitions of a working fluid (evaporation at the evaporator and condensation at the condenser) to transport heat efficiently. The capillary wick structure enables the working fluid to circulate between phases, absorbing heat at the hot conductor part and releasing it at the cooler housing
2Temperature
If the distance between the hot region and heat sink is large, then the nominal current contact can be positioned optimally, but heat dissipation becomes problematic
Solution Approach 1:
The heat pipe acts as a thermal intermediary that bridges the large physical distance between the hot conductor part and the housing heat sink. Through phase change heat transfer, it efficiently transports thermal energy over this distance, overcoming the limitation of conventional conduction which would be insufficient over such distances
Solution Approach 2:
The heat pipe changes the thermal conductivity parameter by using phase transition heat transfer instead of conventional conduction. This enables effective heat transfer over the large distance that would otherwise be thermally resistive, maintaining heat dissipation efficiency despite the extended distance
3Reliability
If conductor parts have different cross-sectional areas and current density distributions, then electrical connection is achieved, but unequal temperature distribution occurs
Solution Approach 1:
The heat pipe system applies local thermal management by placing the evaporator specifically at the hotspot region of the conductor part where unequal current density causes excessive heating. This localized approach addresses the temperature non-uniformity without requiring changes to the overall conductor geometry needed for electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pipe arrangement significantly enhances heat dissipation, reducing temperature differences and extending the operational temperature range of the switching device by effectively distributing heat across a larger area, preventing overheating and improving safety and efficiency.
Implementation Method 1
a heat pipe arrangement, such that a thermal connection between the first region and the second region is formed by at least one heat pipe arrangement
Implementation Method 2
At the first region a working medium is evaporated in the at least one heat pipe arrangement. The phase transition temperature of the working medium inside the heatpipe arrangement is preferably about ninety degree Celsius to one hundred fifteen degree Celsius. The working medium is then cooled down at a second region and condenses again
Implementation Method 3
The first and second conductor part are arranged in a volume of a housing which is filled with an insulating gas as insulating medium
Implementation Method 4
conduction of the heat generated inside the switching device is not only performed by thermal conduction within the conductor part itself
Implementation Method 5
convective flow of heat
Data Source
Figure 1
Figure 2~9
Figure 3
AI summary
The invention relates to a switching device a respective substation and a thermal balancing method. According to the invention, the switching device includes a first conductor part (7) and a second conductor part (8) being electrically connectable. The first and second conductor parts (7, 8) are arranged in a volume of a housing (6) which is filled with an insulating gas as insulating medium. A first region (7.1) of said first conductor part (7) is connected to a second region (7.2) of said first conductor part (7) by means of a heat pipe arrangement (18). The second region (7.2) is located at a distance from the first region (7.1). The first and second region (7.1, 7.2) of said first conductor part (7) are at different temperature levels when a current flow, in particular a nominal current flow, traverses the switching device (1) along a current path (5) during the operating state of the switching device. Thus, the heat pipe arrangement will improve the temperature distribution of the switching device.