Symmetric Bond Pattern Interface for 3D Semiconductor Master-Slave Communication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 3D semiconductor device packaging technologies face challenges in efficiently communicating between a master chip and multiple slave chips, particularly in achieving compact and reliable signal transmission with stable latency for enhanced performance.
Innovation Solution
The implementation of a 3D semiconductor device interface with a master interface and slave interfaces, featuring symmetric bond patterns that allow for efficient signal transmission and reception, utilizing through-silicon via (TSV) structures and hybrid bond patterns to connect master and slave chips, ensuring constant and predictable latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple slave chips are stacked on master chip in 3D package structure, then functionality and integration are improved, but signal transmission reliability and latency stability deteriorate
Solution Approach 1:
The bond pattern array is segmented into multiple rows including a first row, a second row, and intermediate rows. This segmentation allows for organized signal distribution across multiple slave chips, improving signal transmission reliability by structuring the connectivity pattern in a manageable and systematic way.
Solution Approach 2:
The bond pattern employs an asymmetric design where the first row and second row are not identical to the intermediate rows. This asymmetry enables differentiated signal paths for different functional requirements, allowing reliable signal transmission while supporting multiple slave chips with varying communication needs.
2Productivity
If bond patterns are arranged to connect master chip with multiple slave chips, then communication efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
Different rows in the bond pattern array have different configurations tailored to specific communication needs. The first row, second row, and intermediate rows can be optimized for different signal types or communication priorities, enabling efficient communication while keeping each row's design relatively simple and manageable.
3Stability of the object's composition
If symmetric bond pattern with central row and data rows is used, then signal transmission stability is improved, but device complexity increases
Solution Approach 1:
The symmetric bond pattern design with a central row and data rows serves multiple functions simultaneously. The central row can handle control signals while data rows handle data transmission, providing stable signal transmission across multiple slave chips with a unified, multi-functional interface structure that reduces overall system complexity.
Data Source
AI summary
An interface for a semiconductor device includes a master device and a plurality of slave devices. The interface includes a master interface and a slave interface. The master interface is implemented in the master device and includes a master bond pattern of master bonds arranged as a first array. The slave interface is implemented each slave device and includes a slave bond pattern of slave bonds arranged as a second array. The first array of the master bonds includes a first central row and first data rows in two parts being symmetric to the first central row. The second array of the slave bonds includes a second central row and second data rows in two parts being symmetric to the second central row. The first central row and the second central row are aligned in connection, and the first data rows are connected to the second data rows.