Symmetric Capacitor Package Layout for Matched RF Port Response
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Solution Overview
Problem
Package devices, particularly those including capacitors, face issues with asymmetric electrical properties at high frequencies due to structural asymmetry, limiting their application and requiring continuous updates.
Innovation Solution
A package device configuration with a redistribution layer and an integrated passive device layer featuring symmetric capacitors, where both ports have the same resistance, ensuring that scattering parameters measured at each port are the same, thereby reducing directivity problems and improving electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a capacitor is used in a package device for high-frequency operation, then the device can perform high-frequency functions, but asymmetric electrical properties occur at different output terminals due to structural asymmetry
Solution Approach 1:
The patent applies asymmetry principle by intentionally designing a symmetric capacitor structure where the first and second capacitors have identical geometries, materials, and electrical properties. This symmetric configuration ensures that both ports exhibit the same electrical characteristics at high frequencies, eliminating the directivity problems caused by conventional asymmetric capacitor designs.
2Adaptability or versatility
If continuous updates and adjustments are made to package device structures, then application requirements can be met, but device complexity increases
Solution Approach 1:
The patent implements universality by creating a symmetric capacitor structure that can serve multiple functions and applications. The first and second capacitors, being identical in structure and properties, can be interconnected in various configurations (series, parallel, or bridge) to meet different application requirements without requiring separate capacitor designs, thereby reducing overall device complexity.
Data Source
AI summary
An embodiment of the disclosure provides a package device including a redistribution layer, an integrated passive device layer, a first port, and a second port. The integrated passive device layer contacts the redistribution layer. The integrated passive device layer has at least one capacitor. The at least one capacitor includes a first capacitor and a second capacitor. The first port is electrically connected to the first capacitor and the second capacitor. The second port is provided opposite to the first port. The second port is electrically connected to the first capacitor and the second capacitor. The first port and the second port have the same resistance.