Symmetric Test Key De-embedding for High-Frequency Component Measurement
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Solution Overview
Problem
Conventional high-frequency component measurement and calibration methods, such as SOLT and TRL, are prone to calibration errors due to variations in probing depth and position, leading to inaccurate measurements of the device under test.
Innovation Solution
A high-frequency component test device and method utilizing symmetrically arranged front-level and back-level test keys with the same electrical length and characteristic impedance, which measure S parameters and convert them into ABCD parameter matrices to de-embed the device under test, thereby removing parasitic effects and reducing calibration errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional calibration methods (SOLT or TRL) are used, then measurement can be performed, but calibration error increases due to probing depth and position variations
Solution Approach 1:
The patent employs symmetric test keys (front-level and back-level keys with identical electrical length and characteristic impedance) to create a balanced measurement configuration. This symmetry allows error cancellation by measuring the same structure from both ends, thereby eliminating the impact of probing depth and position variations on calibration accuracy.
Solution Approach 2:
The patent implements a calibration process where measurement data from both front-level and back-level keys are used to calculate and apply correction factors. The system continuously refines the calibration by using the measured S-parameters to update the error model, ensuring high measurement reliability even when probing conditions vary.
2Adaptability or versatility
If multiple calibration kits (SOLT requiring four kits or TRL requiring three sets) are used, then calibration coverage is improved, but calibration complexity increases
Solution Approach 1:
The patent develops a universal test key structure that can serve multiple calibration functions simultaneously. The symmetric test keys can be used for both SOLT and TRL calibration methods, as well as for de-embedding applications, eliminating the need for separate calibration kits for different measurement requirements.
Solution Approach 2:
The patent combines the functions of multiple calibration kits into a single integrated test key structure. By merging the front-level and back-level keys with identical characteristics, the system achieves the calibration coverage of multiple kits while reducing the number of physical components and simplifying the calibration procedure.
3Ease of operation
If probing depth and position vary, then measurement flexibility is maintained, but calibration error increases
Solution Approach 1:
The patent uses the symmetric test key measurements to continuously monitor and correct for probing variations. By measuring the same structure from both front and back ends, the system can detect and compensate for probing depth and position differences, maintaining calibration accuracy regardless of probing flexibility.
Solution Approach 2:
The patent employs the back-level key measurements as a counterbalance to the front-level key measurements. Any error introduced by probing variations in one measurement is counteracted by the corresponding measurement from the other end, effectively canceling out the calibration error while preserving probing flexibility.
Data Source
AI summary
A high-frequency component test device including a test key and a test module is provided. The test key includes a front-level key and a back-level key which are arranged symmetrically and have the same electrical length and characteristic impedance. The test module is used to measure an S parameter of the front-level key and the back-level key connected directly and an S parameter of a structure where a device under test (DUT) is added between the front-level key and the back-level key. The test module performs S parameter calculation in the frequency domain and converts the S parameter into an ABCD parameter matrix, and then obtains an ABCD parameter of a de-embedded DUT using a matrix root-opening operation and an inverse matrix operation.