Symmetrical Cold Plate Design for Liquid Cooling
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Solution Overview
Problem
Current liquid cooling systems for electronic equipment face challenges in improving cold plate design and manufacturing efficiency, performance, cost-effectiveness, reliability, and scalability to manage increasing heat generation from high-power components.
Innovation Solution
A symmetric cold plate design with advanced fluid distribution and sealing structures, along with a mounting structure, is proposed to enhance thermal management, manufacturability, and reliability, simplifying the design and integration of liquid cooling solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional asymmetric cold plate design is used, then fluid distribution can be optimized for specific heat patterns, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies asymmetry in reverse by using symmetrical design principles. The cold plate features symmetrical fin structures, symmetrical fluid channels, and symmetrical mounting features that allow the same component to be used in multiple orientations, thereby reducing manufacturing complexity and cost while maintaining effective heat dissipation across different heat generation patterns
2Temperature
If liquid cooling is implemented to remove heat from high-power components, then thermal management performance improves, but system complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple functions into a single integrated cold plate structure. The fluid channels, fin structures, and mounting features are combined into one component that can be manufactured as a single piece, reducing assembly steps and manufacturing complexity while providing effective liquid cooling for high-power electronic components
Solution Approach 2:
The symmetrical cold plate design provides multi-functionality by being able to cool different heat generation patterns and be installed in various orientations using the same component. The universal design reduces the need for multiple specialized cold plates, thereby improving manufacturing efficiency
3Temperature
If cold plate design is optimized for specific electronic packaging platforms, then thermal performance improves, but scalability to different platforms decreases
Solution Approach 1:
The symmetrical cold plate with standardized mounting features and fluid connections can be adapted to different electronic packaging platforms while maintaining effective thermal management. The universal design allows scalability across various platform sizes and configurations without requiring complete redesign
4Ease of manufacture
If symmetric cold plate design is used, then manufacturability and usability improve, but fluid distribution optimization for asymmetric heat patterns may be reduced
Solution Approach 1:
While maintaining overall symmetrical structure for manufacturability, the patent incorporates local variations in fin density, channel dimensions, or feature placement to optimize fluid distribution for specific heat generation patterns. This allows asymmetric heat patterns to be effectively cooled while preserving the benefits of symmetrical manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal management performance, increased manufacturability, and reliability, while reducing costs and supporting the growing power requirements of electronic equipment, thus addressing the scalability and usability challenges in liquid cooling systems.
Implementation Method 1
cold plate for use in liquid cooling systems... liquid circulates through it to remove the heat
Implementation Method 2
liquid circulates through it to remove the heat
Data Source
AI summary
Embodiments are disclosed of a cold plate including substantially identical first and second frames. The first frame includes a first frame body with a first recess, a first mating surface surrounding the first recess, and a first plurality of heat transfer fins in the first recess. The second frame includes a second frame body with a second recess, a second mating surface surrounding the second recess, and a second plurality of heat transfer fins in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first and second recesses form a fluid chamber. The first and second pluralities of heat transfer fins form a plurality of fin channels in the fluid chamber. Advanced sealing structures can be formed between the first and second mating surfaces. A first fluid port and a second fluid port are fluidly coupled via fluid channels to the plurality of fin channels.