Symmetrical Power Stage ICs for High-Power Integrated Circuits
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Solution Overview
Problem
Multiphase power converters in integrated circuit form generate excessive heat, which is difficult to dissipate without compromising the form factor of the substrate, posing a challenge in high-power applications.
Innovation Solution
A circuit assembly for a power converter is designed with power stage IC dies mounted on one side of a substrate and output inductors on the opposing side, utilizing a magnetic core and a heatsink to manage heat dissipation, while maintaining the form factor and efficiency of the power converter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiphase power converters are implemented in integrated circuit form to increase output power, then power delivery capability is improved, but heat dissipation becomes difficult without compromising form factor
Solution Approach 1:
The patent utilizes the third dimension by routing output inductors through a magnetic core that extends vertically through the substrate, with inductors positioned on opposite sides of the substrate. This three-dimensional arrangement allows heat to dissipate in multiple directions (upward and downward through the substrate) rather than being confined to a single plane, effectively managing thermal load while maintaining high power output capability.
Solution Approach 2:
The output inductors are nested through the magnetic core that penetrates the substrate, with inductors on opposite sides effectively utilizing the same vertical space. This nested configuration allows compact integration of high-power components while distributing heat generation and dissipation paths throughout the three-dimensional structure, preventing thermal accumulation in any single location.
2Device complexity
If output inductors are mounted on the same side as power stage IC dies, then device complexity is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
Instead of placing all components on the same side of the substrate, the patent utilizes the vertical dimension by routing inductors through the magnetic core that extends through the substrate. This allows inductors to be positioned on opposite sides, creating separated heat sources that can dissipate heat in opposite directions, thereby improving heat dissipation efficiency without significantly increasing device complexity.
3Temperature
If heatsink is attached to power stage IC dies, then heat dissipation is improved, but form factor is compromised
Solution Approach 1:
The heatsink is integrated into the existing substrate structure rather than being added as a separate external component. The substrate itself serves as a heat dissipation pathway, with the magnetic core and inductor arrangement enabling heat to conduct through the substrate to opposite sides, where it can be dissipated. This nested integration avoids increasing the external form factor while effectively managing heat from the power stage IC dies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by multiphase power converters, ensuring reliable operation without compromising the form factor or power delivery, thus addressing the heat management challenge in high-power integrated circuit applications.
Implementation Method 1
Two output inductors go through a magnetic core
Implementation Method 2
A heatsink is attached to surfaces of the power stage IC dies
Data Source
AI summary
A circuit assembly for a power converter includes a substrate, power stage integrated circuit (IC) dies, and output inductors that connect switch nodes of the power stage IC dies to an output node of the power converter. The power stage IC dies are mounted on one side of the substrate and the output inductors are mounted on an opposing side of the substrate. Two output inductors go through a magnetic core. A heatsink is attached to surfaces of the power stage IC dies. A power stage IC die has a pair of switching transistors, and a switch node formed by the switching transistors is connected by an output inductor to the output node of the power converter.