Synchronized Laser Marking for Fabric Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing laser marking technologies for substrates, such as fabrics, require high energy or slow marking speeds, limiting productivity and increasing costs, as they often rely on stationary pre-heating methods that do not efficiently utilize low-energy lasers or allow for high-speed marking across multiple areas.
Innovation Solution
A method and system that synchronizes the movement of energizing and marking laser beams across the substrate, using a low-energy energizing laser to pre-heat areas while a high-energy marking laser applies the mark simultaneously, allowing for overlapping irradiation to reduce energy requirements and increase marking speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If stationary pre-heating methods are used, then the substrate areas are adequately heated for marking, but the marking speed is slow and energy consumption is high
Solution Approach 1:
The patent applies dynamics by transitioning from stationary pre-heating to synchronized moving beams. Both the energizing beam and marking laser are moved simultaneously across the substrate, maintaining dynamic heating and marking throughout the process. This allows continuous high-speed marking while keeping the substrate at optimal temperature through the moving energizing beam, resolving the contradiction between adequate heating and marking speed.
Solution Approach 2:
The energizing beam performs preliminary heating action continuously during the marking process. Rather than separate pre-heating followed by marking, the energizing beam precedes and accompanies the marking laser, ensuring the substrate is always at the required temperature for efficient marking. This preliminary and concurrent heating action enables high-speed marking without sacrificing temperature control.
2Manufacturing precision
If high energy lasers are used for marking, then marking quality is maintained, but energy consumption increases and thermal degradation of dyes occurs
Solution Approach 1:
The patent changes the parameter of substrate temperature through the energizing beam, raising it to an optimal range that reduces the energy threshold for marking. By modifying the thermal state of the substrate dynamically during processing, the marking laser can operate at lower energy levels while maintaining marking quality, thus resolving the contradiction between marking quality and energy consumption.
Solution Approach 2:
The patent converts the potential harm of excessive heat into benefit by using controlled, localized heating from the energizing beam. This targeted thermal energy, when properly synchronized with the marking laser, creates optimal conditions for low-energy marking while preventing the harmful thermal degradation that would occur with uncontrolled high-energy laser application alone.
3Use of energy by moving object
If low energy lasers are used for marking, then energy consumption is reduced, but marking speed decreases and marking quality deteriorates
Solution Approach 1:
The energizing beam changes the thermal parameter of the substrate, raising its temperature to reduce the energy threshold for effective marking. This allows low-energy marking lasers to achieve the same marking effect that would otherwise require high-energy lasers, thereby enabling both low energy consumption and high marking speed to coexist.
Solution Approach 2:
The energizing beam acts as an intermediary that prepares the substrate by heating it to optimal temperature, creating favorable conditions for the marking laser to work efficiently at low energy levels. This intermediary thermal preparation enables low-energy lasers to maintain high marking speed and quality, resolving the contradiction between energy use and productivity.
4Device complexity
If stationary pre-heating is used, then simple system configuration is maintained, but marking can only be performed on fixed areas
Solution Approach 1:
The patent introduces dynamics by moving both the energizing beam and marking laser simultaneously across the substrate. This dynamic configuration allows the system to mark any area the beams can reach, providing versatility and adaptability while maintaining a relatively simple system structure through the use of standard beam delivery components operated in synchronized fashion.
Solution Approach 2:
The moving beam system achieves multi-functionality by being able to mark any area of the substrate within the beam travel range. The same energizing and marking beams can be directed to different locations and patterns, making the system adaptable to various marking requirements without requiring fundamentally different system configurations, thus resolving the contradiction between simplicity and versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the energy density needed for marking, enabling faster and more efficient laser marking of fabrics, such as denim, while maintaining quality and avoiding thermal degradation of dyes, thus enhancing manufacturing productivity and cost-effectiveness.
Implementation Method 1
energizing radiation source arranged to generate an energizing radiation for energizing areas of the substrate
Implementation Method 2
marking laser beam for marking portions of said areas of the substrate
Data Source
Figure 1~2
Figure 3~5a
Figure 5b~6
AI summary
A method of laser marking comprises a) irradiating an area (A) of a substrate (S) with energizing radiation generated by an energizing radiation source (Le) to make said irradiated area (A) require less laser energy to be laser marked, and b) irradiating a portion (P) of said area (A) with marking radiation from a marking laser beam (Bm) generated from a marking laser source (Lm) to laser mark said portion (P) of said area (A), wherein the irradiations from the energizing radiation source (Le) and from the marking laser source (Lm) are at least partly overlapping each other in space and time, and are implemented by moving both the energizing radiation and the marking laser beam (Bm) towards various areas (A) of the substrate (S) and portions (P) thereof, respectively, in a synchronized manner. The system is adapted to implement this method.