Synchronous Transfer and Repair for Micro LED Component Processing
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Solution Overview
Problem
The challenges of micro LED display manufacturing include insufficient precision in mass transfer and the need for time-consuming mass repair processes, leading to high costs and inefficiencies as the number of display pixels increases.
Innovation Solution
A component processing apparatus that synchronously performs detection and repair processes during mass transfer, utilizing a transfer unit and a repair unit to arrange and correct components in processing areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mass transfer is performed with high precision requirements, then transfer yield is improved, but additional mass repair process is required which increases time consumption and cost
Solution Approach 1:
The patent combines the transfer process and repair process into a single integrated operation. The transfer unit transfers components while the repair unit simultaneously performs repair operations on the same wafer, merging two previously sequential processes into one concurrent process. This eliminates the need for separate post-transfer repair steps, reducing time consumption while maintaining high transfer yield through real-time defect correction.
Solution Approach 2:
The repair unit performs repair actions during the transfer process itself, rather than waiting for transfer completion. By conducting repair operations preliminarily and concurrently with transfer, the system addresses defects before they accumulate, avoiding the need for additional dedicated repair time after transfer is complete.
2Measurement precision
If the number of display pixels increases, then display resolution is improved, but the number and difficulty of repairing each wafer increases significantly resulting in high costs
Solution Approach 1:
The wafer surface is divided into multiple processing areas, and the transfer and repair operations are segmented into parallel task streams. The control unit coordinates multiple transfer units and repair units to work on different processing areas simultaneously, breaking down the complex repair task into manageable parallel operations. This segmentation reduces the effective complexity of repairing high-resolution wafers with numerous pixels by distributing the repair workload across multiple concurrent operations.
Solution Approach 2:
The system dynamically adjusts the coordination between transfer and repair units based on real-time processing needs. As the number of pixels and repair requirements increase, the control unit dynamically manages the allocation and coordination of multiple repair units across different processing areas, optimizing the repair process complexity for high-resolution displays.
3Manufacturing precision
If separate transfer and repair processes are used, then each process can be optimized independently, but overall processing efficiency decreases and throughput is reduced
Solution Approach 1:
The patent merges transfer and repair processes into a single coordinated operation where both functions are performed simultaneously on the wafer. The control unit synchronizes multiple transfer units and repair units to work concurrently on different processing areas, maintaining process optimization while dramatically improving overall processing efficiency and throughput compared to sequential operations.
Solution Approach 2:
The system ensures continuous useful action by eliminating idle time between transfer and repair operations. While transfer units are transferring components, repair units are simultaneously repairing defects on the same wafer, ensuring that no time is wasted waiting for one process to complete before starting the other. This continuous parallel operation maximizes productivity while maintaining process quality.
Data Source
AI summary
A component processing apparatus including a carrying unit, a control unit and a processing module is provided. The carrying unit is adapted to carry an object to be processed. The control unit is signally connected to the carrying unit and defines a surface of the object to be processed as a plurality of processing areas. The processing module is controlled by the control unit. The processing module includes a transfer unit and a repair unit. The transfer unit is adapted to configure a plurality of components to each processing area according to a set sequence between the plurality of processing areas. The repair unit and the transfer unit process the object to be processed synchronously. Additionally, the repair unit removes a part of the components configured by the transfer unit in each processing area, or configures another component to a vacant position in each processing area.