Synthetic Jet Packaging for Electronic Cooling
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Solution Overview
Problem
Existing cooling solutions for electronic devices often require additional design modifications and may not effectively dissipate heat in environments that cannot provide sufficient cooling, especially when using synthetic-jet-based systems.
Innovation Solution
A self-contained synthetic jet device with a housing, connector, power electronics, and membranes that form multiple synthetic jets within the housing, allowing for efficient convective cooling of electronic components without the need for special system redesign, and can be easily inserted or replaced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling device is added to assist heat removal, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The patent combines the cooling device with the electronic device housing into a single integrated unit. The housing serves dual functions as both structural enclosure and cooling chamber, eliminating the need for separate cooling device installation and reducing overall system complexity while maintaining effective heat dissipation capability
2Temperature
If multiple membranes are used to form synthetic jets, then cooling effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The single membrane structure performs multiple functions: it acts as both the flexible boundary for synthetic jet formation and the heating element for thermal management. This multi-functional design achieves effective cooling through synthetic jets while simplifying manufacturing by eliminating the need for multiple separate membrane components
3Temperature
If existing cooling solutions are implemented, then heat removal is improved, but system adaptability decreases due to required design modifications
Solution Approach 1:
The cooling system is designed as a self-contained modular unit that can be independently integrated into different electronic devices. This segmented design allows the cooling device to be easily adapted to various applications without requiring modifications to the existing system architecture, maintaining system adaptability while providing effective heat removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides effective convective cooling for electronic components by forming multiple synthetic jets within a single housing, enhancing heat removal and extending the lifespan of electronic devices without requiring additional design modifications.
Implementation Method 1
A first synthetic jet is formed between the first membrane and the top section of the housing, a second synthetic jet is formed between the first and second membranes and a third synthetic jet is formed between the second membrane and the bottom section of the housing
Implementation Method 2
The device provides effective convective cooling for electronic components by forming multiple synthetic jets within a single housing, enhancing heat removal
Data Source
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AI summary
A synthetic jet device includes a housing, a connector within the housing configured to communicate with an exterior power source, driver electronics within the housing, a first membrane within the housing, and a second membrane within the housing.