Synthetic Setae Substrate Support for Thin Glass Transport
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Solution Overview
Problem
The increasing size and thinness of substrates in substrate processing pose challenges in handling and processing without breakage, as existing support systems often cause bulging and require significant space, leading to issues with material deposition quality and glass breakage.
Innovation Solution
A method and support system utilizing a synthetic setae material adhesive to attach and stabilize large area substrates vertically, reducing bulging and space requirements, with a support body and adhesive configuration that mimics the gecko's adhesive capabilities, allowing for secure attachment and reduced substrate breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mechanical clamp elements or frame carriers are used to support large area substrates, then the substrates can be held and transported, but bulging occurs on the substrate due to forces pushing the substrate edge towards the center, increasing the likelihood of breakage
Solution Approach 1:
The patent replaces traditional mechanical clamp elements and frame carriers with a magnetic field-based support system. Magnets embedded in the carrier generate magnetic forces that hold the substrate without mechanical contact, eliminating the bulging forces caused by mechanical clamping while maintaining secure holding and transport capability.
Solution Approach 2:
The patent changes the physical state and properties of the support interaction from mechanical contact forces to magnetic field forces. By adjusting magnetic field strength and distribution, the system achieves uniform support across the substrate surface without the localized pressure points that cause bulging in mechanical systems.
2Ease of operation
If traditional frame or plate carriers are used to support large area substrates, then the substrates can be transported through processing machines, but the space required in the deposition chamber is significantly increased
Solution Approach 1:
The patent uses a thin carrier with embedded magnets that can flex slightly to accommodate the substrate, replacing rigid frame structures. This thin-film approach maintains substrate transport capability while minimizing the space required in the deposition chamber, as the carrier profile is much thinner than traditional frame carriers.
3Area of stationary object
If the substrate size is increased to meet display production requirements, then larger display areas are achieved, but the handling and processing becomes increasingly challenging without sacrificing throughput by glass breakage
Solution Approach 1:
The magnetic field-based support system provides contactless holding that scales effectively with substrate size. Larger substrates are supported by distributed magnetic forces across the entire surface, avoiding the edge-focused mechanical stresses that limit the size of substrates that can be safely handled with traditional clamp and frame systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces substrate bulging and breakage while improving the uniformity of deposited layers and reducing space needed in deposition chambers, enabling the handling of larger and thinner substrates without compromising processing quality.
Implementation Method 1
an adhesive (120), wherein the material of the adhesive (120) is a synthetic setae material and wherein the adhesive (120) is configured to attach the support body (160) to a substrate
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2~3
AI summary
A method and a support for holding a substrate, wherein the support is included in a transportation system configured to transport the substrate. The method includes attaching an adhesive to the support, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the substrate to the support; and attaching the adhesive to the substrate. Moreover, the thickness of the substrate is about 0,3 mm or less, and/ or wherein the substrate has a size of 1.4 m2 or more. The support includes a support body and an adhesive, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the support body to the substrate, wherein the support is included in a transportation system configured to transport the substrate.