System and method for phase-change cooling of an electronic rack
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Solution Overview
Problem
Existing cooling systems for data centers, particularly those with high-power density electronic racks, face challenges in maintaining a proper thermal environment due to increased heat generation, as conventional air cooling systems may not efficiently manage the higher heat loads associated with high-density electronics.
Innovation Solution
A phase-change cooling system utilizing two heat-transfer loops, a primary and a secondary loop, where the primary loop provides constant cooling through a primary condenser and cold plates, and the secondary loop engages when high-power workloads exceed the primary loop's capacity, with a pressure valve regulating the transition between the two loops based on vapor pressure thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling systems are used for conventional racks, then the thermal environment can be maintained, but the systems cannot effectively cool high-power density racks due to higher heat generation rates
Solution Approach 1:
The system changes the cooling parameter from air cooling to liquid cooling by introducing a coolant that circulates through cold plates attached to IT components. This parameter change enables effective heat removal from high-power density racks while maintaining proper thermal environment, directly resolving the contradiction between maintaining temperature control and adapting to high-power density scenarios
2Adaptability or versatility
If liquid cooling is implemented for high-power density racks, then cooling effectiveness is improved, but system complexity increases compared to air cooling systems
Solution Approach 1:
The system employs self-regulating components including expansion vessels that automatically manage pressure, thermostatic valves that automatically control coolant flow based on temperature, and pressure switches that automatically activate pumps when needed. These self-service mechanisms reduce the need for complex external control systems while maintaining effective liquid cooling for high-power density racks
3Temperature
If CRAC units are used to maintain thermal environment, then cooling air can be supplied, but the units may be unable to effectively cool high-power density racks due to higher heat load
Solution Approach 1:
The system extracts heat directly at the source by attaching cold plates with coolant channels directly to IT components generating heat. This extraction approach removes heat load before it dissipates into the rack environment, enabling effective cooling of high-power density racks without relying on CRAC units to remove heat from the ambient air
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This self-regulating system ensures effective cooling under varying conditions, reduces complexity, and allows for cost-effective control by using the secondary condenser only as needed, maintaining constant cooling capacity during normal operations while adapting to changes in rack configuration and heat load.
Implementation Method 1
heat generated by the IT component is transferred into the liquid coolant by the cold plate
Implementation Method 2
The condenser condenses the vapor back into liquid coolant
Data Source
AI summary
According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.