System for thermal management in multiple operating conditions
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Solution Overview
Problem
Existing temperature control systems for electronic equipment often fail to manage temperature variations effectively in uncontrolled environments, requiring both heating and cooling, and are inefficient and difficult to control, especially for outdoor applications where temperatures can range from freezing to hot.
Innovation Solution
A dual-loop temperature control system that includes both a cooling and a heating loop, where the heating loop functions as a bypass of the cooling loop, using a shared working fluid and a thermally coupled temperature control plate with integrated heating and cooling capabilities, allowing for simultaneous or separate operation of both loops to manage temperature fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-loop cooling system is used, then cooling capability is provided, but heating capability is lost
Solution Approach 1:
The patent combines a cooling loop and a heating loop into a single integrated temperature control system. The cooling loop includes a cold plate with coolant flow, while the heating loop uses a heater integrated into the same cold plate structure. This merging allows the system to provide both cooling and heating capabilities through a unified design, resolving the contradiction between single-loop simplicity and dual-function versatility.
Solution Approach 2:
The cold plate serves multiple functions: it acts as a cooling surface when coolant flows through it, and as a heating surface when electrical heaters are activated within it. This multi-functionality allows the same structural component to adapt to different temperature control needs, enabling the system to operate in both heating and cooling modes without requiring separate independent systems.
2Adaptability or versatility
If an electrical heater in a cooling loop is used, then both heating and cooling are provided, but control difficulty increases
Solution Approach 1:
The system incorporates temperature sensors that continuously monitor the temperature of electronic components and feed this information back to a controller. The controller automatically adjusts the coolant flow rate and heater power based on the sensed temperature, providing closed-loop control. This feedback mechanism simplifies operation by eliminating the need for manual control adjustments and ensures stable temperature regulation across varying environmental conditions.
3Adaptability or versatility
If a dual-loop system with separate heating and cooling systems is used, then both heating and cooling are provided, but space requirement increases
Solution Approach 1:
The heating elements are nested within the structure of the cold plate itself. The heaters are integrated into the internal channels or mounting structure of the cold plate, allowing the heating loop to occupy the same physical space as the cooling loop. This nesting approach eliminates the need for separate external heating components, significantly reducing the overall space requirement while maintaining full dual-functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enables efficient thermal management of electronic components across varying temperatures by allowing for both heating and cooling, optimizing power usage and reducing the need for large spaces, thus ensuring reliable operation in diverse environmental conditions.
Implementation Method 1
A cooling loop (102) is provided and the cooling loop is fluidly coupled to the temperature control plate (108) so as to allow a working fluid to flow through the cooling loop
Implementation Method 2
A heating loop (104) is provided and the heating loop is fluidly coupled to the temperature control plate (108) so as to allow a working fluid to flow through the heating loop
Implementation Method 3
A temperature control plate (108) is provided and the temperature control plate is thermally coupled to heat-generating electronic components (106)
Data Source
AI summary
Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.