Systems and methods for cryogenic cooling
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Solution Overview
Problem
Conventional cooling systems for computing devices have limitations in lowering processor temperatures, which can lead to decreased computing efficiency and potential damage due to heat generation, and they often struggle to maintain optimal operating conditions for increased processing power in reduced form factors.
Innovation Solution
A cryogenic cooling system that utilizes an evaporation plate thermally connected to the processor and a cryogenic fluid with a boiling point below 273 K, such as liquid nitrogen, to absorb heat and lower the processor temperature to near its boiling point, thereby enhancing computing capacity and allowing for increased processor density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used, then the processor can be cooled to a certain extent, but the processor temperature cannot be lowered below a certain threshold, limiting computing efficiency and processor density
Solution Approach 1:
The patent utilizes the phase transition of cryogenic fluid (liquid to gas) at extremely low temperatures to achieve superior cooling效果. The cryogenic fluid evaporates on the processor surface, absorbing large amounts of heat through latent heat of vaporization, thereby lowering processor temperature to levels unachievable by conventional cooling systems.
Solution Approach 2:
The patent changes the fundamental cooling parameter from conventional refrigerant temperatures (above 273 K) to cryogenic temperatures (below 273 K). This parameter change enables the system to achieve processor temperatures that were previously inaccessible, directly improving computing efficiency and enabling higher processor density.
2Productivity
If processor size is reduced to increase density, then computing capacity increases, but heat generation per unit volume increases, making cooling more difficult
Solution Approach 1:
The phase transition mechanism provides extremely high heat absorption capacity in a thin layer on the processor surface. This allows efficient heat removal from high-density processors without requiring large cooling components, thus maintaining compact form factor while managing increased heat generation from higher processor density.
3Device complexity
If conventional cooling systems are used, then the system structure remains simple, but the cooling capability is insufficient for high-performance processors
Solution Approach 1:
The patent introduces a cryogenic fluid as an intermediary cooling medium between the processor and the external environment. This intermediary substance enables heat transfer at temperatures far below what conventional direct cooling systems can achieve, significantly enhancing cooling capability while maintaining relatively simple system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cryogenic cooling system effectively reduces processor temperatures to levels below those achievable with conventional systems, improving computing efficiency and enabling higher processor density, allowing for more compact server configurations and increased computing capacity.
Implementation Method 1
the evaporation plate causing the cryogenic fluid to change phase to a gas
Implementation Method 2
A cryogenic cooling system may include an evaporation plate thermally connected to the processor. The cryogenic cooling system may release a cryogenic fluid onto the evaporation plate
Data Source
AI summary
A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K.