Systems and methods for thermal control for electronic devices
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Solution Overview
Problem
Existing cooling systems for electronic devices require significant volume for ducts or passages carrying cooling air and heat exchangers, limiting their efficiency and necessitating improved methods for thermal control.
Innovation Solution
A thermoelectric cooler system that enhances heat extraction and transfer to a heat sink, allowing for smaller heat sinks and air passages, with a control system monitoring temperatures and humidity to adjust power supply and throttle device activity when necessary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air flow cooling is used, then heat dissipation is achieved, but significant volume is required for ducts or passages and heat exchangers
Solution Approach 1:
A thermoelectric cooler is introduced as an intermediary device between the electronic component and the heat sink. This mediator actively pumps heat from the component to the heat sink, enabling effective heat dissipation while significantly reducing the volume of air passages and heat exchanger surfaces required compared to passive air flow cooling systems
Solution Approach 2:
The patent replaces the mechanical air flow cooling system (requiring ducts, passages, and large heat exchangers) with a thermoelectric cooling system that uses solid-state thermoelectric coolers. This substitution eliminates the need for complex air flow paths and large heat exchange surfaces, dramatically reducing the overall system volume while maintaining effective heat dissipation
2Productivity
If power to thermoelectric cooler is increased, then heat extraction rate increases, but energy consumption increases
Solution Approach 1:
The control system dynamically adjusts the power supplied to the thermoelectric cooler based on real-time temperature monitoring. When the electronic component temperature exceeds the maximum operating temperature, the control system increases power to enhance heat extraction; when temperature is within acceptable range, power is reduced or shut off, optimizing the balance between heat extraction rate and energy consumption
Solution Approach 2:
The system implements a feedback control mechanism where temperature sensors continuously monitor the electronic component temperature, and the control system adjusts the thermoelectric cooler power accordingly. This closed-loop feedback ensures that power consumption is optimized while maintaining the component temperature within safe operating limits
3Temperature
If thermoelectric cooler operates at high power, then cooling effectiveness increases, but dew point conditions may cause water damage
Solution Approach 1:
The control system continuously monitors temperature and humidity conditions and adjusts thermoelectric cooler operation accordingly. When conditions approach the dew point, the control system automatically reduces or shuts off cooler operation, preventing condensation and water damage while maintaining cooling effectiveness when conditions are safe
Solution Approach 2:
The system takes preliminary action by monitoring humidity and temperature to predict approaching dew point conditions before condensation occurs. The control system proactively adjusts thermoelectric cooler operation to prevent dew point conditions, thereby avoiding water damage before it can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective cooling with reduced space requirements, improving processing power, storage capacity, heat dissipation, and energy efficiency while preventing water damage by managing dew point conditions.
Implementation Method 1
a first thermoelectric cooler thermally connected to the first solid state drive
Implementation Method 2
a cooling system uses a thermoelectric cooler to extract heat from an electronic device at a greater rate than unassisted conduction of heat would produce
Implementation Method 3
a heat sink (e.g., a finned heat sink cooled by cooling air)
Implementation Method 4
a heat sink (e.g., a finned heat sink cooled by cooling air)
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A method for temperature control. In some embodiments, the method includes sensing a first temperature of an electronic device (105), determining that the first temperature exceeds a first threshold (205), and increasing a power supplied to a thermoelectric cooler (110) thermally connected to the electronic device (105). The increasing of the power may include increasing the power in response to determining that the first temperature exceeds the first threshold (205).