Systems and methods for two-phase cooling of electronic components
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Solution Overview
Problem
Existing heat sink technologies are inefficient in effectively managing thermal dissipation from electronic components, particularly in high-performance computing devices, where heat management is critical to prevent damage and maintain operational efficiency.
Innovation Solution
A heat sink with an expansion chamber that adiabatically expands a working fluid, utilizing an orifice and flaring passage to vaporize and transfer heat from the heat source to the fluid, enhancing thermal management through vaporization and adiabatic expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional heat sink technologies are used, then the structure is simple and easy to manufacture, but the thermal dissipation efficiency is insufficient for high-performance computing devices
Solution Approach 1:
The patent utilizes phase transition of working fluid (liquid to vapor) within the expansion chamber to enhance heat transfer efficiency. The fluid absorbs heat from the electronic component, vaporizes, and then condenses, creating a highly effective thermal management cycle that dramatically improves cooling capability compared to traditional solid heat sinks
Solution Approach 2:
The patent changes the physical parameters of the working fluid (pressure, temperature, phase) to optimize heat transfer. By controlling pressure differential between inlet and outlet ports and utilizing adiabatic expansion, the system achieves efficient heat removal while maintaining operational simplicity
2Productivity
If adiabatic expansion of working fluid is implemented, then cooling efficiency is improved, but device complexity increases due to expansion chamber and fluid management systems
Solution Approach 1:
The patent merges the heat sink body and expansion chamber into a single integrated structure. The heat sink body serves dual functions as both the thermal interface to the electronic component and as part of the fluid expansion system, eliminating the need for separate expansion chambers and reducing overall system complexity
Solution Approach 2:
The heat sink body performs multiple functions: it serves as the thermal interface to the electronic component, contains the expansion chamber, manages fluid flow, and facilitates heat transfer. This multi-functionality reduces the number of separate components needed while maintaining high cooling efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transfers heat from electronic components to the working fluid, improving cooling efficiency and maintaining device performance by reducing the temperature of the working fluid as it expands and vaporizes within the heat sink.
Implementation Method 1
The body is configured to receive heat from the heat source
Implementation Method 2
the expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink
Implementation Method 3
utilizing an orifice and flaring passage to vaporize and transfer heat from the heat source to the fluid
Data Source
AI summary
A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.