T-Shaped Connection Terminal Module Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing modules with interlayer connection conductors face challenges such as inaccurate via hole formation due to laser processing, increased manufacturing costs, and erosion of resin layers and wiring substrates from chemical solutions used in desmearing and plating processes.
Innovation Solution
A method involving column-shaped connection terminals with a T-shaped cross section, where the first end portion has a larger diameter than the second end portion, is used to form interlayer connections without via holes, utilizing a support body with magnetic force for mounting and a resin sealing process that reduces voids and allows for efficient resin filling and surface grinding for enhanced connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If via holes are formed by laser process in resin layers, then interlayer connection is achieved, but accuracy variations occur due to difficulty in adjusting laser output power
Solution Approach 1:
The invention extracts and eliminates the laser processing step entirely by replacing it with mechanical drilling of through-holes. This removes the source of accuracy variations caused by laser output power adjustment difficulties, while still achieving the required interlayer connection functionality through conductor paste filling in the mechanically drilled holes.
Solution Approach 2:
The invention replaces the optical/laser-based hole formation system with a mechanical drilling system. This substitution eliminates the complexity of adjusting laser output power and provides more consistent and controllable hole formation accuracy through straightforward mechanical drilling parameters.
2Reliability
If via holes are formed through multiple process steps including desmearing and conductor paste filling, then interlayer connection is achieved, but manufacturing cost increases and production time extends
Solution Approach 1:
The invention performs preliminary action by forming conductor patterns on the wiring substrate before mounting the connection terminals. The through-holes are drilled and conductor paste is applied in advance, so that when connection terminals are mounted, the interlayer connection is already prepared and ready, eliminating the need for subsequent desmearing and via fill plating steps.
Solution Approach 2:
The invention merges the formation of interlayer connection conductors with the mounting process of connection terminals. By preparing the through-holes and conductor paste filling before terminal mounting, and then mounting terminals that directly utilize these prepared structures, multiple steps are combined into a more integrated and efficient process flow.
3Ease of manufacture
If chemical solutions are used for desmearing processing or via fill plating, then via holes are processed, but resin layers and wiring substrate are eroded
Solution Approach 1:
The invention extracts and removes the chemical processing steps (desmearing and via fill plating) from the manufacturing process. By using mechanical drilling followed by conductor paste application and firing, the harmful chemical solutions that cause erosion of resin layers and wiring substrates are completely eliminated from the process.
Solution Approach 2:
The invention uses conductor paste as a temporary material that is applied to fill the through-holes and then transformed into a permanent conductor through firing. This replaces the need for chemical plating processes, using a simpler, less harmful material application method that achieves the same functional result without the harmful side effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and costs, minimizes erosion risks, and enhances connection strength and electrical connectivity by eliminating the need for via holes and allowing for the use of various resin types, while increasing productivity and reducing suction errors during terminal mounting.
Implementation Method 1
a support body having a magnetic force is made to attract large-diameter first end portions of the plurality of connection terminals
Data Source
AI summary
When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).