T-Type LC Filter Electronic Component Signal Integrity
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Solution Overview
Problem
Existing electronic components with π-type LC filter structures require large capacitance values, leading to poor signal transmission characteristics and degraded signal quality, while components with ground electrodes between coils suffer from magnetic flux cancellation and weakened coupling, resulting in further signal quality degradation.
Innovation Solution
An electronic component with a multilayer body containing stacked insulating layers, electrically connected first and second coils, an inner ground electrode between facing coils, and outer ground electrodes outside the second coils, forming a T-type LC filter structure to achieve resonance with smaller capacitance values and enhanced coupling between coils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a π-type LC filter structure is adopted, then resonance can be achieved, but large capacitance values are required which degrade signal transmission characteristics and signal quality
Solution Approach 1:
The patent inverts the conventional π-type LC filter structure by adopting a T-type filter configuration. In the T-type structure, the ground electrode is positioned between the series arm coils rather than having capacitor electrodes parallel to the coils, which fundamentally changes the filter topology and allows resonance with smaller capacitance values, thereby improving signal transmission characteristics.
Solution Approach 2:
The patent utilizes the stacking direction (vertical dimension) to arrange the ground electrode between coils in the T-type structure, rather than arranging electrodes only in the horizontal plane. This dimensional arrangement enables the ground electrode to face multiple coils simultaneously, creating effective capacitance coupling without requiring large capacitance values, thus resolving the contradiction between resonance achievement and signal transmission quality.
2Reliability
If a ground electrode is arranged between first and second coils, then capacitances are generated, but magnetic flux cancellation occurs which weakens coupling and degrades signal transmission characteristic
Solution Approach 1:
The patent applies local quality by making the ground electrode selectively face only the series arm coils (first coils) while being positioned away from the shunt arm coils (second coils) in the stacking direction. This selective facing arrangement ensures that capacitance is generated between the ground electrode and the series arm coils without causing magnetic flux cancellation, thereby maintaining strong coupling and good signal transmission characteristics.
Solution Approach 2:
The ground electrode acts as an intermediary element that mediates between the series arm coils and the shunt arm coils. By positioning the ground electrode to face only the series arm coils and not the shunt arm coils, it provides the necessary capacitance coupling while avoiding interference with the magnetic flux of the shunt arm coils, thus preventing magnetic flux cancellation and maintaining signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal quality degradation by improving signal transmission characteristics and coupling between coils, allowing for better matching of capacitance values and increased common mode noise attenuation, while also balancing stress and contraction during firing.
Implementation Method 1
Capacitances are generated between the inner ground electrode and the first coils and the second coils
Implementation Method 2
magnetic flux generated by the first coil and magnetic flux generated by the second coil
Data Source
AI summary
An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode.