TAB-IC Pad Protection via Segmented Inspection Line Spacing
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Solution Overview
Problem
During the separation of tape-automated bonding integrated circuits (TAB-ICs) from display panels, the pads are often damaged, making it difficult to reuse the panels due to the separation of pads along with the TAB-ICs.
Innovation Solution
A display device design that includes a substrate with a display area and a non-display area, featuring an inspection line spaced apart from the pad by 5 μm to 50 μm, connected via a conductive member, which prevents damage to the pad by allowing the inspection line and conductive member to be separated instead of the pad during TAB-IC removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the inspection line is disposed close to the pad for compact layout, then the device complexity is reduced, but the pad may be damaged during TAB-IC separation
Solution Approach 1:
The patent divides the conductive structure into separate functional elements: the pad, the inspection line, and the conductive member connecting them. This segmentation allows the inspection line to be positioned close to the pad for compact layout while the conductive member acts as a buffer zone that absorbs stress during TAB-IC separation, preventing pad damage.
Solution Approach 2:
The conductive member serves as an intermediary element between the pad and the inspection line. During TAB-IC separation, this intermediate conductive structure absorbs the mechanical stress and prevents direct force transmission to the pad, thereby protecting the pad while allowing close positioning of the inspection line.
2Reliability
If the inspection line is spaced apart from the pad by a larger distance, then the pad is protected from damage, but the non-display area increases
Solution Approach 1:
The patent applies local quality by creating a specific spatial relationship where the inspection line is positioned at an optimized distance (5-50 μm) from the pad. This localized spacing provides sufficient protection buffer zone exactly where needed near the pad, while the rest of the non-display area can be minimized for compact device design.
Solution Approach 2:
The patent optimizes the spacing parameter between the inspection line and pad to a specific range (5-50 μm). This parameter optimization balances the competing requirements: providing enough distance to protect the pad during separation while minimizing the overall non-display area to maintain compact device dimensions.
3Ease of manufacture
If the pad is directly connected to the inspection line without a conductive member, then the manufacturing process is simplified, but the pad is vulnerable to damage during TAB-IC removal
Solution Approach 1:
The conductive member is introduced as an intermediary element between the pad and inspection line. During TAB-IC removal, this intermediate structure absorbs the mechanical stress and prevents direct force transmission to the pad, thereby protecting the pad while allowing close positioning of the inspection line.
4Ease of manufacture
If the TAB-IC is bonded directly to the pad, then the bonding process is simplified, but the pad is likely to be separated along with the TAB-IC
Solution Approach 1:
The patent divides the conductive structure into separate functional elements: the pad, the inspection line, and the conductive member connecting them. This segmentation allows the inspection line to be positioned close to the pad for compact layout while the conductive member acts as a buffer zone that absorbs stress during TAB-IC separation, preventing pad damage.
Data Source
AI summary
A display device includes: a substrate including a display area in which a plurality of pixels are disposed and a non-display area adjacent to the display area; a plurality of pads disposed in the non-display area; an inspection line disposed in the non-display area of the substrate and being spaced apart from the pad; a conductive member connecting the pad and the inspection line; and a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member.