Power Storage Tab Joint Plate Layout for Compact Protection Circuits
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Solution Overview
Problem
Conventional power storage packs require a significant area for the protection circuit substrate to connect power storage tabs, limiting the reduction in size of the protection circuit substrate.
Innovation Solution
Incorporating a semiconductor element of chip-size package type face-down mounted on the protection circuit substrate and a metal plate for power storage tab joint with a thickness of at most 0.2 mm, allowing the power storage tab to be joined to the metal plate instead of the substrate, eliminating the need for a connection region on the substrate and enabling a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the protection circuit substrate is used to connect power storage tabs directly, then the connection is simple, but the substrate area becomes large
Solution Approach 1:
The connection structure is divided into separate functional components: a dedicated metal plate for power storage tab joint (separated from the protection circuit substrate) and a semiconductor element mounted on the substrate. This segmentation allows the substrate to focus only on protection functions while the metal plate handles tab connections, reducing substrate area.
Solution Approach 2:
A metal plate is introduced as an intermediary component between the power storage tab and the protection circuit substrate. This metal plate serves as a mediator that connects the tab to the semiconductor element, eliminating the need for direct substrate-tab connection and reducing the required substrate area.
2Strength
If a thick metal plate is used for power storage tab joint, then the structural strength is high, but the overall size and weight increase
Solution Approach 1:
The metal plate thickness parameter is optimized to be between 0.03 mm and 0.2 mm, which is significantly thinner than conventional plates. This parameter change achieves the required strength through the plate's design and material properties rather than relying on thickness, thereby reducing weight.
Solution Approach 2:
The metal plate is made from materials with high strength-to-weight ratio, such as aluminum alloys or copper alloys, which provide sufficient mechanical strength at reduced thickness. This composite material approach allows the plate to maintain strength while minimizing weight.
3Area of stationary object
If the power storage tab is joined to the protection circuit substrate, then the connection is direct, but the substrate area required is large
Solution Approach 1:
The metal plate serves as a reliable intermediary connection between the power storage tab and the protection circuit substrate. This intermediate component provides a dedicated connection path that enhances reliability while allowing the substrate to be smaller, as the connection function is separated from the substrate.
Solution Approach 2:
The connection structure transitions from a planar substrate-based connection to a three-dimensional assembly where the metal plate can be joined to the tab and folded to connect with the semiconductor element. This dimensional change allows for more efficient space utilization and improved connection reliability.
Data Source
AI summary
A power storage pack includes: a power storage cell; a power storage tab; a protection circuit substrate; a semiconductor element; and a metal plate for power storage tab joint that is connected to the semiconductor element on the first main surface of the metal plate for power storage tab joint and that includes a portion whose thickness is at most 0.2 mm. The metal plate for power storage tab joint is joined to the power storage tab on the second main surface of the metal plate for power storage tab joint to include an overlap portion in which the power storage tab, the metal plate for power storage tab joint, the semiconductor element, and the protection circuit substrate overlap each other; and there is a portion in which a region that may be the conduction path between the power storage tab and the protection circuit substrate overlaps the overlap portion.