TAB Tape Sprocket Hole Metal Pattern for Particle Control
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Solution Overview
Problem
Conventional TAB package manufacturing processes face defects and reduced reliability due to friction-induced copper or metal particle generation between the driving roller and the semiconductor chip, leading to decreased production yield and reliability.
Innovation Solution
A TAB tape with a base film featuring a transfer area where a metal pattern is selectively removed, exposing the base film and forming a metal plating layer pattern only at the periphery of sprocket holes, eliminating the metal layer from the transfer area to prevent metal particle generation during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal pattern layer is formed across the entire base film including the transfer area, then electrical connectivity and structural integrity are improved, but metal particle generation increases due to friction with the driving roller
Solution Approach 1:
The metal pattern layer is selectively removed from the transfer area where sprocket holes are located, extracting only the portion that causes friction-induced particle generation while preserving the metal layer in other areas for electrical connectivity and structural support
Solution Approach 2:
The base film is designed with non-uniform metal layer distribution: the transfer area has no metal pattern layer to prevent particle generation, while other areas maintain the metal layer for electrical functionality, creating different local properties in different regions
2Object-generated harmful factors
If the metal pattern layer is completely removed from the transfer area, then metal particle generation is reduced, but mechanical strength at the sprocket hole region decreases
Solution Approach 1:
The metal plating layer is applied selectively only at the periphery of sprocket holes rather than uniformly across the transfer area, providing localized mechanical reinforcement exactly where the sprocket holes need strength while leaving the central transfer area metal-free to prevent particle generation
3Strength
If a metal plating layer is added at the periphery of sprocket holes, then mechanical strength is improved, but process complexity increases
Solution Approach 1:
The metal plating layer is formed during the initial metal deposition process before the photoresist patterning step, using the photoresist pattern as a mask to define the periphery regions, thereby integrating the plating step into the existing manufacturing flow without adding separate plating operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces metal particle generation and enhances the reliability of the TAB package by preventing metal layer-induced defects and improving mechanical strength during the assembly process.
Implementation Method 1
copper or a metal pattern layer does not exist at a row of sprocket holes that generates friction by a driving roller
Implementation Method 2
the paired structure is formed with metal plating structure
Data Source
AI summary
The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.