Tablet Epoxy Resin for Semiconductor Encapsulation
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Solution Overview
Problem
Existing epoxy resin compositions for encapsulating semiconductor elements face challenges in reducing thickness deviation and warpage deviation of semiconductor packages during compression molding, leading to equipment contamination and wire sweep defects, which are not adequately addressed by methods like centrifugal milling and hot cut processes.
Innovation Solution
A tablet form of epoxy resin composition is developed, comprising 97 wt% or more of tablets with specific diameter and height ranges, satisfying a standard deviation equation and compression density of 1.2 g/mL to 1.7 g/mL, prepared using a method that includes an epoxy resin master batch with a curing agent, inorganic filler, and curing accelerator, optimized for compression molding to reduce thickness deviation and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional epoxy resin compositions are used for encapsulation, then the encapsulation process can be performed, but thickness deviation and warpage deviation of semiconductor packages increase
Solution Approach 1:
The patent changes the physical form parameter of the epoxy resin composition from conventional liquid or paste to tablet form with specific dimensional parameters (diameter 0.5-2.0mm, height 0.1-1.0mm). This parameter change in the material form enables uniform compression molding, thereby reducing thickness deviation and warpage while maintaining encapsulation quality
Solution Approach 2:
The epoxy resin composition is segmented into discrete tablet particles with controlled size distribution. This segmentation allows for uniform distribution during compression molding, preventing the thickness deviation and warpage issues that occur with conventional continuous forms of the material
2Manufacturing precision
If conventional epoxy resin compositions are used for encapsulation, then the encapsulation process can be performed, but warpage deviation of semiconductor packages increases
Solution Approach 1:
The patent changes the physical form parameter of the epoxy resin composition from conventional liquid or paste to tablet form with specific dimensional parameters (diameter 0.5-2.0mm, height 0.1-1.0mm). This parameter change in the material form enables uniform compression molding, thereby reducing thickness deviation and warpage while maintaining encapsulation quality
Solution Approach 2:
The epoxy resin composition is segmented into discrete tablet particles with controlled size distribution. This segmentation allows for uniform distribution during compression molding, preventing the thickness deviation and warpage issues that occur with conventional continuous forms of the material
3Ease of manufacture
If conventional epoxy resin compositions are used for encapsulation, then the encapsulation process can be performed, but equipment contamination occurs
Solution Approach 1:
The patent changes the physical form parameter of the epoxy resin composition from conventional liquid or paste to tablet form with specific dimensional parameters (diameter 0.5-2.0mm, height 0.1-1.0mm). This parameter change in the material form enables uniform compression molding, thereby reducing thickness deviation and warpage while maintaining encapsulation quality
Solution Approach 2:
The epoxy resin composition is segmented into discrete tablet particles with controlled size distribution. This segmentation allows for uniform distribution during compression molding, preventing the thickness deviation and warpage issues that occur with conventional continuous forms of the material
4Reliability
If conventional epoxy resin compositions are used for encapsulation, then the encapsulation process can be performed, but wire sweep defects occur
Solution Approach 1:
The patent changes the physical form parameter of the epoxy resin composition from conventional liquid or paste to tablet form with specific dimensional parameters (diameter 0.5-2.0mm, height 0.1-1.0mm). This parameter change in the material form enables uniform compression molding, thereby reducing thickness deviation and warpage while maintaining encapsulation quality
Solution Approach 2:
The epoxy resin composition is segmented into discrete tablet particles with controlled size distribution. This segmentation allows for uniform distribution during compression molding, preventing the thickness deviation and warpage issues that occur with conventional continuous forms of the material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tablet form of the epoxy resin composition significantly reduces thickness deviation and warpage of semiconductor packages, minimizes equipment contamination, and effectively prevents wire sweep, improving process yield and semiconductor device quality.
Implementation Method 1
tableting the powder composition by compressing the powder composition in a die using a compression load in a range of 0.1 ton to 1.0 ton
Data Source
AI summary
A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1,σD×σHσD+σH≤1.0,where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.