Tableted Sealing Resin Forming for Defect-Free Compression Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing compression molding methods face challenges with resin sealing of strip-type electronic components due to wire deformation, difficulty in holding thin or large workpieces, molding defects from film biting, uneven resin scattering, residual gas, and dust generation, especially when using granular resin and cavities in upper or lower molds.
Innovation Solution
A forming apparatus and method that tablets a base resin into a specific shape using a tableting mold, incorporating a release film supply for both upper and lower molds, to form a sealing resin that prevents resin flow defects and ensures uniform distribution, reducing dust and gas residuals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the cavity is provided in the upper mold and sealing resin is supplied in advance, then resin sealing can be performed, but the wire portion of the workpiece contacts the sealing resin and is deformed
Solution Approach 1:
The sealing resin is supplied onto the workpiece before placing it in the mold cavity, allowing the resin to be positioned in advance without contacting the wire portions during the molding process
Solution Approach 2:
Instead of supplying resin to the cavity first (conventional method), the invention inverts the sequence by supplying resin directly onto the workpiece surface, reversing the traditional molding approach to avoid wire deformation
2Manufacturing precision
If the workpiece is held on the upper mold, then wire deformation is avoided, but holding thin or large workpieces becomes difficult and dropping occurs
Solution Approach 1:
The sealing resin is supplied onto the workpiece before molding, allowing the workpiece to be held on the lower mold with proper support structures in place, combining the benefits of wire protection with stable workpiece holding
3Manufacturing precision
If a film is interposed between the lower mold and sealing resin, then molding defects from film biting occur, but the molding stroke becomes large for thick molded products
Solution Approach 1:
The sealing resin is supplied onto the workpiece surface in advance, eliminating the need for a release film between the mold and resin, thereby preventing film biting defects while maintaining a compact molding stroke
4Ease of manufacture
If granular resin is used, then resin sealing can be performed, but dust generation and difficult handling occur
Solution Approach 1:
The invention changes the physical state of the sealing resin from granular to a form that can be supplied as a cohesive material onto the workpiece, reducing dust generation while maintaining sealing effectiveness
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present invention addresses the problem of providing an apparatus and a method for forming a sealing resin with which it is possible to achieve a compression molding device and a compression molding method capable of preventing the occurrence of molding defects. As a solution, an apparatus (100) for forming a sealing resin according to the present invention, which forms by tableting a base resin (Rm) a sealing resin (R) to be used for compression molding of a workpiece (W), comprises a tablet mold (102) that accommodates a predetermined amount of the base resin (Rm) in one or both of a pair of a lower mold (106) and an upper mold (104) subjected to mold opening/closing, and that performs tableting so as to form the sealing resin (R) into a predetermined shape corresponding to the shape of the workpiece (W).