Tacky Overmolded Carrier Assemblies for Secure Semiconductor Handling
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Solution Overview
Problem
Conventional carrier trays for semiconductor components face limitations such as restricted movement, potential damage from external forces, and inadequate electrostatic discharge protection, leading to increased transport costs and lower manufacturing efficiency.
Innovation Solution
A carrier assembly comprising a primary injection-molded component with a secondary injection-molded component having a tacky surface, created through overmolding, which securely holds semiconductor components without risk of damage and facilitates easy detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor components are placed in punched cavities to avoid damage, then component protection is improved, but lateral movement is limited and manufacturing capacity is reduced
Solution Approach 1:
The patent changes the retention mechanism from mechanical constraints (punched cavities) to adhesion-based retention (tacky material properties). By adjusting the tackiness parameter of the material, components can be securely held during transport yet easily removed during manufacturing, resolving the contradiction between protection and productivity.
Solution Approach 2:
The patent uses a continuous thin film of tacky material covering the carrier surface instead of discrete punched cavities. This flexible retention layer allows components to be held securely while permitting easy removal and lateral movement, thereby improving both protection and manufacturing capacity.
2Reliability
If conventional carrier trays are used for transport, then component containment is achieved, but external forces can cause damage and electrostatic discharge protection is inadequate
Solution Approach 1:
The patent employs a composite structure combining a rigid carrier tray with a viscoelastic tacky material layer. This composite design provides both mechanical containment from the rigid tray and shock absorption plus electrostatic discharge protection from the viscoelastic material, simultaneously addressing containment and harmful factor protection.
Solution Approach 2:
The viscoelastic tacky material serves as a pre-applied cushioning layer between the component and external environment. This beforehand cushioning protects components from shock, vibration, and electrostatic discharge during transport and handling, reducing damage from external forces before they can affect the components.
3Reliability
If punched cavity designs are used for component retention, then component security is improved, but lateral and longitudinal movement is restricted
Solution Approach 1:
The patent changes the retention mechanism from fixed mechanical constraints to adjustable adhesion forces. By controlling the tackiness parameter of the material, components remain secure during transport but can be easily moved laterally and longitudinally during manufacturing operations, resolving the contradiction between security and ease of operation.
4Stability of the object's composition
If rigid carrier trays are used for component transport, then structural stability is improved, but electrostatic discharge protection is inadequate
Solution Approach 1:
The patent creates a composite system where the rigid carrier tray provides structural stability while the viscoelastic tacky material layer provides electrostatic discharge protection. This composite approach allows both structural stability and ESD protection to coexist without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carrier assembly enhances securement and handling of semiconductor components, reducing damage risk and improving manufacturing efficiency by allowing lateral and longitudinal movement without displacement, while complying with JEDEC standards for electrostatic discharge.
Implementation Method 1
The carrier assembly can include a viscoelastic material capable of absorbing and dissipating energy from external forces applied to the semiconductor components
Implementation Method 2
A carrier assembly comprising a primary injection-molded component with a secondary injection-molded component having a tacky surface
Data Source
AI summary
Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.