Tacky Elastomeric Cleaning for Pick-and-Place Vacuum Tools
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Solution Overview
Problem
The existing cleaning methods for pick-and-place apparatuses in semiconductor device handling machines require unscheduled downtime for manual cleaning, which can damage tools and reduce productivity due to the need for wet chemical processes and mechanical scrubbing, and are inefficient in removing debris from vacuum apertures and suction tools.
Innovation Solution
A cleaning device and method using a tacky elastomeric cleaning material with intermediate layers and micro-features that can be applied in situ to the pick-and-place apparatus, allowing for regular cleaning of vacuum and suction tools without removing them from the machine, using a combination of compliant and rigid layers to effectively remove debris without damaging the tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual cleaning with wet chemicals and mechanical scrubbing is used, then debris is removed from the pick-and-place apparatus, but the vacuum pick-up tool is damaged and downtime increases
Solution Approach 1:
The patent replaces mechanical scrubbing with a compliant cleaning material that uses elastic deformation and adhesion to remove debris. The compliant material deforms under vacuum pressure to contact and clean the pick-up tool surfaces without requiring mechanical scrubbing actions, thereby eliminating tool damage while maintaining cleaning effectiveness.
Solution Approach 2:
The patent introduces a compliant cleaning material as an intermediary between the vacuum pick-up tool and the cleaning process. This intermediate layer absorbs the cleaning action through its deformable nature, protecting the delicate pick-up tool surfaces from direct mechanical contact while still enabling effective debris removal through adhesion and elastic recovery.
2Reliability
If the pick-and-place apparatus is taken offline for cleaning, then the aperture and nozzles can be cleaned, but productivity and throughput are reduced
Solution Approach 1:
The patent enables the pick-and-place apparatus to clean itself during normal operation or between uses. The compliant cleaning material is positioned to automatically contact the pick-up tool apertures and nozzles when the tool is inserted or during idle periods, allowing the system to maintain its own vacuum strength without requiring external manual intervention or taking the equipment offline.
Solution Approach 2:
The patent allows cleaning to occur continuously or near-continuously without interrupting the pick-and-place operation. The compliant material remains in position to provide ongoing cleaning action, and the pick-up tool can be quickly inserted for cleaning without removing it from the system, maintaining continuous productive operation while preventing vacuum degradation.
3Reliability
If rigid cleaning materials are used to remove compacted debris, then cleaning effectiveness is improved, but the pick-up tool surface is damaged
Solution Approach 1:
The patent changes the mechanical parameters of the cleaning material from rigid to compliant, allowing it to deform and adapt to the pick-up tool geometry. This compliance enables the material to reach into apertures and nozzles effectively while distributing cleaning forces uniformly, preventing localized stress concentrations that would cause surface damage to the delicate pick-up tool.
Solution Approach 2:
The patent employs a composite cleaning material structure with a compliant base layer and an abrasive or adhesive surface layer. The compliant base provides gentle contact and deformation to access tight spaces, while the surface layer performs the actual debris removal through adhesion or mild abrasion, combining the benefits of gentleness and cleaning effectiveness without the harshness of fully rigid materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous operation of semiconductor device handling machines by maintaining vacuum strength and preventing die breakage through regular, preventative cleaning, reducing downtime and extending the mean-time-between-maintenance without using wet chemicals or mechanical scrubbing.
Implementation Method 1
a vacuum mechanism that has an up-and-down movement for picking up the electronic devices from the one holding tray
Implementation Method 2
The suction of the vacuum force is created by a vacuum mechanism
Implementation Method 3
A cleaning device and method using a tacky elastomeric cleaning material with intermediate layers and micro-features
Data Source
AI summary
A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.