Taiko Wafer Laser Ring Cutting to Prevent Edge Cracking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional Taiko wafer ring cutting methods using blade cutting lead to incomplete coverage, air bubbles, wafer cracks, and edge chipping during packaging, and the removal of the Taiko ring causes abnormal cracking due to tape pulling.
Innovation Solution
A laser cutting method is employed to separate the Taiko ring from the wafer, using vacuum suction for precise positioning and rotating laser beams to cut the edge portion, followed by frame mounting without prior tape removal, thereby improving yield and preventing edge cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If blade cutting is used to remove the Taiko ring, then the Taiko ring can be removed to facilitate packaging operations, but wafer cracks and edge chipping occur due to high-speed cutting action
Solution Approach 1:
The patent replaces the mechanical blade cutting system with a laser cutting system. The laser beam cuts the Taiko ring without physical contact, eliminating mechanical stresses that cause wafer cracks and edge chipping while maintaining the ability to remove the Taiko ring for packaging operations.
Solution Approach 2:
The patent changes the cutting method from mechanical blade contact to non-contact laser energy application. This parameter change transforms the cutting mechanism from mechanical force to thermal energy, allowing precise cutting without the harmful mechanical impacts that cause wafer damage.
2Ease of manufacture
If the Taiko ring is removed after frame mounting, then the Taiko ring can be separated from the wafer, but tape pulling causes abnormal cracking on the wafer edge
Solution Approach 1:
The patent performs laser cutting of the Taiko ring before frame mounting. By removing the Taiko ring in advance, the subsequent frame mounting process does not involve tape pulling on the Taiko ring, thereby preventing the abnormal cracking that would occur during or after tape removal.
Solution Approach 2:
The patent inverts the conventional sequence by removing the Taiko ring before frame mounting rather than after. This reversal of the process sequence eliminates the problem of tape pulling causing wafer edge cracks during or after Taiko ring removal.
3Productivity
If frame mounting is performed before Taiko ring removal, then the wafer can be secured for processing, but incomplete coverage or air bubbles occur in the Taiko ring area
Solution Approach 1:
The patent removes the Taiko ring before frame mounting, eliminating the obstacle that causes incomplete coverage and air bubbles. With the Taiko ring removed in advance, the frame can be mounted with complete coverage and proper adhesion without any intervening structures interfering with the tape application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser cutting method enhances the precision and yield of Taiko ring cutting, eliminating edge cracking issues by performing the Laser Ring Cutting operation before frame mounting, ensuring a stable and crack-free wafer edge.
Implementation Method 1
A laser beam is used to perform ring cutting on the Taiko wafer, so that the edge portion and the Taiko ring of the Taiko wafer are separated from the wafer portion of the Taiko wafer
Implementation Method 2
the step of disposing the Taiko wafer on the platform further comprises using vacuum suction to fix the Taiko wafer on the platform
Data Source
AI summary
A Taiko wafer ring cut process method is provided. The Taiko wafer ring cut process method includes the following steps. A Taiko wafer is disposed on the platform. The Taiko wafer is performing by laser ring cutting so that a Taiko ring and an edge portion of the Taiko wafer are separated from a wafer portion of the Taiko wafer. The wafer portion of the Taiko wafer is adhered to a frame.