Talbot Lithography Angular Illumination for High Resolution

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Solution Overview

Problem

Achromatic Talbot lithography and displacement Talbot lithography face limitations in achieving high-resolution patterns with smaller periods and efficient light utilization, particularly when dealing with imperfect substrate surfaces and high topographies, and are restrictive in generating intensity profiles with large gradients and high contrast.

Innovation Solution

A photolithographic method involving a mask with a periodic or quasi-periodic pattern, where the substrate is illuminated at different angles of incidence to expose the photosensitive layer to a selected angular distribution of illumination energy density, allowing for varying separation to ensure the entire range of lateral intensity distributions are captured, enabling the printing of high-resolution patterns with smaller periods and improved light efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the separation between mask and substrate is precisely controlled to achieve high-resolution patterns, then manufacturing precision is improved, but device complexity increases due to precise positioning requirements

Engineering Contradiction:
Improvepattern resolutionVSAvoidpositioning system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the illumination parameters by using multiple angles of incidence instead of normal incidence. This parameter change transforms the intensity distribution at the substrate, enabling high-resolution pattern formation without requiring precise control of the mask-substrate separation distance. The angular distribution of illumination becomes the critical control parameter rather than the separation distance.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent transitions from controlling the system in one dimension (separation distance) to controlling it in another dimension (illumination angle). By illuminating from multiple angles, the system achieves depth of field extension and improved resolution without relying on precise positional control in the separation dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the duty cycle of the periodic pattern is optimized to yield high-contrast intensity distribution, then manufacturing precision is improved, but adaptability decreases due to restrictive pattern requirements

Engineering Contradiction:
Improveintensity contrastVSAvoidpattern design flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent creates a universal illumination method that works with various pattern types and duty cycles. By using multiple illumination angles, the system can achieve high-contrast intensity distributions for different pattern geometries without requiring specific duty cycle optimization, thereby increasing adaptability while maintaining manufacturing precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent changes the illumination parameters (angular distribution) to achieve the desired intensity contrast directly, rather than relying on optimizing the pattern geometry parameters (duty cycle). This allows flexibility in pattern design while maintaining high manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If the depth of field is increased to accommodate imperfect substrate flatness, then adaptability is improved, but manufacturing precision deteriorates due to reduced intensity distribution control

Engineering Contradiction:
Improvesubstrate flatness toleranceVSAvoidintensity distribution control
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent controls the intensity distribution by adjusting the angular parameters of illumination rather than relying on precise control of the separation distance. This dimensional shift in control mechanism allows the system to maintain intensity distribution control even when the substrate flatness varies, thereby increasing depth of field and adaptability without sacrificing manufacturing precision.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Manufacturing precision

If conventional photolithography with imaging systems is used to achieve high resolution, then manufacturing precision is improved, but device complexity increases due to complex optical systems

Engineering Contradiction:
Improvepattern resolutionVSAvoidoptical system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the complex imaging system from the photolithography process. Instead of using lenses and mirrors to form an image, the method directly uses diffracted light from the mask illuminated at multiple angles to create the desired intensity distribution on the substrate. This extraction of the imaging system reduces device complexity while maintaining or improving manufacturing precision.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical/optical imaging system with a wave-optics-based direct illumination method. The complex system of lenses and mirrors is substituted by a simpler illumination system that uses angularly distributed light sources to directly create the required intensity patterns through diffraction and interference effects.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for a wider variety of high-resolution patterns to be printed with enhanced depth of focus, improved light utilization, and higher spatial frequency, overcoming the limitations of existing techniques by providing greater control over intensity distribution and pattern characteristics.

Implementation Method 1

the light of each wavelength at each angle transmitted by the mask forms a range of lateral intensity distributions between Talbot planes

Methodology Applied
Scientific EffectDiffraction: Diffraction

Implementation Method 2

A specialized photolithographic technique based on the Talbot effect is advantageous for transferring periodic patterns of features defined in a mask onto a photosensitive layer on a substrate

Methodology Applied
Scientific EffectTalbot effect:

Implementation Method 3

Chemical or physical changes that occur in the photoresist may be used in subsequent processes to obtain desired patterns of materials on the substrate surface

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS9036133B2Lithographic fabrication of general periodic structures by exposing a photosensitive layer to a range of lateral intensity distributions
Publication Date: 2015.05.19 EULITHA
  • US9036133B2 patent drawing
  • US9036133B2 patent drawing
  • US9036133B2 patent drawing

AI summary

A lithographic method related to Talbot imaging for printing a desired pattern of features that is periodic or quasi-periodic in at least one direction onto a substrate surface, which method includes providing a mask bearing a pattern of mask features, arranging the substrate parallel and in proximity to the mask, providing an illumination source having a central wavelength and a spectral bandwidth, forming from said source an illumination beam with an angular distribution of intensity, arranging the distance of the substrate from the mask and exposing the mask pattern to said beam so that each angular component of illumination exposes the substrate to substantially the entire range of lateral intensity distributions that occur between successive Talbot image planes for the illumination wavelengths, wherein the angular distribution of the beam is designed in conjunction with the pattern of features in the mask and the distance of the substrate from the mask.