Tall Deposition Ring and Clamp Assembly for PVD Substrate Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In PVD chambers, the deposition of aluminum films on substrates leads to accumulation on process kit shields, causing adhesion to the substrate's backside, resulting in handling issues and broken substrates due to increased deposition power and time.
Innovation Solution
A process kit with a tall deposition ring and clamp assembly is designed, where the deposition ring has an annular band, inner and outer lips, and a channel to reduce adhesion to the substrate's backside, and the clamp assembly prevents vertical movement of the deposition ring if it adheres, ensuring substrate integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If significantly increased process power and deposition time are used to deposit thick aluminum films, then the deposition thickness is improved, but deposition accumulation builds up to the back of the substrate causing adhesion and substrate handling issues
Solution Approach 1:
The harmful deposition accumulation that builds up on the substrate backside is extracted and redirected to accumulate on the deposition ring instead. The deposition ring acts as a sacrificial component that captures the excess aluminum material, preventing it from adhering to the substrate and causing handling issues.
Solution Approach 2:
The deposition ring serves as an intermediary component between the substrate and the deposition source. It intercepts the aluminum vapor flux and provides a surface for deposition accumulation, thereby protecting the substrate from direct exposure to excessive deposition material and preventing backside adhesion.
2Productivity
If deposition accumulation builds up to the back of the substrate, then more process cycles can be completed, but substrate handling issues and broken substrates occur
Solution Approach 1:
The deposition ring extracts and captures the harmful deposition accumulation before it can reach the substrate backside. By providing an alternative surface for material buildup, the ring prevents the adhesion issues that would otherwise compromise substrate integrity and cause breakage during handling.
Solution Approach 2:
The deposition ring provides beforehand cushioning by being positioned to intercept deposition material before it can adhere to the substrate. This protective barrier is in place prior to deposition, preventing the harmful adhesion effect from occurring in the first place.
3Device complexity
If a conventional deposition ring is used, then the device complexity is low, but the deposition ring needs frequent cleaning due to accumulation
Solution Approach 1:
The deposition ring structure is designed to extract and concentrate deposition accumulation in specific areas that are easily accessible for cleaning. The geometric features guide material buildup to predetermined locations, making routine maintenance faster and less time-consuming despite the slightly increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for increased process cycles before cleaning, reduces substrate damage from adhesion, and maintains substrate integrity by preventing the deposition ring from being lifted with the substrate, thus addressing the sticking issue and enhancing substrate handling.
Implementation Method 1
In PVD chambers, the deposition of aluminum films on substrates leads to accumulation on process kit shields
Data Source
AI summary
Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.