Multi-layer Stack Tamper Detection via Embedded Sensor Segmentation

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Solution Overview

Problem

Existing tamper-proof electronic packages are difficult to test and maintain due to the presence of security sensors, making it challenging to detect manufacturing defects or recover components, and they lack effective anti-intrusion features to protect sensitive encryption/decryption keys.

Innovation Solution

A tamper-respondent assembly with a multi-layer stack and embedded tamper-respondent electronic circuit structure, featuring a tamper-detect circuit that includes through-substrate vias and conductive lines to detect any intrusion attempts, triggering an alarm and erasure of encryption keys, while maintaining a secure volume within the package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If security sensors are wrapped fully around the enclosure to detect tampering, then security protection is improved, but testing and component recovery become difficult

Engineering Contradiction:

Improvesecurity protectionVSAvoidtesting difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The security sensor is segmented into multiple discrete components distributed across different layers of the multi-layer stack, rather than wrapped as a single continuous element. This segmentation allows individual sensor portions to be accessed and tested independently while maintaining overall security functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The security sensor is extracted from the traditional wrapped configuration and embedded within the multi-layer stack structure. This extraction allows the sensor to be integrated into the manufacturing process and accessed through layer interfaces, enabling testing and component recovery without compromising security.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If security sensors are wrapped fully around the enclosure to detect tampering, then security protection is improved, but component recovery becomes difficult

Engineering Contradiction:

Improvesecurity protectionVSAvoidcomponent recovery

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The sensor system is divided into discrete segments located at different layers, allowing individual components to be accessed and recovered through layer interfaces without disrupting the entire security system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The security sensor is nested within the multi-layer stack structure, with sensor components embedded in specific layers. This nesting allows components to be accessed through the layer hierarchy while maintaining the integrity of the security system.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Adaptability or versatility

If encryption keys are stored in the electronic assembly for secure communications, then functionality is improved, but vulnerability to theft and fraud increases

Engineering Contradiction:

Improvesecure communication functionalityVSAvoidvulnerability to theft

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The encryption keys are segmented and distributed across multiple secure locations within the electronic assembly, rather than stored in a single location. This segmentation makes it more difficult for malefactors to extract keys through physical access or fraud.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system incorporates preliminary anti-action measures by embedding security sensors and monitoring circuits that detect and respond to tampering attempts before keys can be stolen or misused, thereby preventing fraudulent activities.

Inventive Principle:

Principle #9Preliminary anti-action

4Reliability

If the electronic assembly is encapsulated to protect components, then protection is improved, but access for testing and maintenance becomes difficult

Engineering Contradiction:

Improvecomponent protectionVSAvoidaccessibility for testing

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The encapsulation is segmented into multiple layers with controlled access points, allowing testing and maintenance activities to be performed through specific interfaces without compromising the protection of internal components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The multi-layer stack structure acts as an intermediary between the encapsulated components and the external testing environment, providing controlled access points that enable testing and maintenance while maintaining component protection.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10217336B2Multi-layer stack with embedded tamper-detect protection

Publication Date: 2019.02.26 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.