Tamper-Proof Computer Device Thermal Management via Membrane Heat Sink
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Solution Overview
Problem
Tamper-proof computer devices face challenges in cooling high-performance components due to their sealed nature, which prevents efficient heat dissipation and necessitates the use of lower-power processors to avoid overheating.
Innovation Solution
A tamper-proof computer device design featuring a sealed enclosure with a hollow metal body, a tamper-detecting membrane, and a metal heat sink structure that allows thermal energy transfer from the processor to the enclosure, enabling external cooling methods like fans and liquid cooling without compromising tamper protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the enclosure is sealed to prevent tampering, then tamper protection is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent divides the enclosure into multiple segments: a sealed enclosure for tamper protection, a separate heat sink structure for thermal management, and a membrane sensor system for detecting tampering. This segmentation allows each component to perform its specialized function without compromising the others - the sealed enclosure maintains security while the external heat sink handles heat dissipation.
Solution Approach 2:
The patent introduces a membrane sensor as an intermediary element that serves dual purposes: it acts as part of the tamper detection system while also serving as a thermal interface between the internal processor and external heat sink. This intermediary component enables heat transfer without compromising the sealed enclosure's integrity.
2Power
If high-performance processors are used, then computing power is improved, but thermal energy dissipation worsens
Solution Approach 1:
The patent extracts the heat dissipation function from the sealed enclosure by introducing an external heat sink structure. This allows high-performance processors to be housed within the tamper-proof sealed enclosure while their thermal management is handled by an external component, effectively separating the security function from the thermal management function.
Solution Approach 2:
The patent moves the heat dissipation mechanism from an internal three-dimensional space constraint to an external surface area solution. By placing the heat sink outside the sealed enclosure and using its extended surface area (fins and protrusions), the system dissipates thermal energy in a different spatial dimension without compromising the internal sealed environment.
3Reliability
If the enclosure is completely filled with potting material, then component protection is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent applies local quality by using potting material selectively - filling only the spaces around components within the sealed enclosure for protection, while deliberately leaving thermal pathways clear. The heat sink structure is positioned and designed to maintain optimal thermal contact with processors without requiring complete enclosure filling, thus preserving heat dissipation capability in critical local areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of high-performance computing components while maintaining tamper protection by efficiently transferring heat from the processor to the enclosure, allowing for conventional cooling methods to be applied externally, thus preventing overheating.
Implementation Method 1
a metal heat sink structure (50), which is thermally connected to said computer processor (30) and arranged in direct thermal contact with said side (44) of at least one of the first (42) and second (43) membrane parts not facing said inside surface (22), so that thermal connection is achieved between said metal heat sink structure (50) and said enclosure (10), via said membrane part in question
Data Source
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AI summary
Tamper-proof computer device (1) comprising a sealed enclosure (10), in turn comprising a hollow metal body (20) having an inside surface (22); a computer processor (30), arranged inside said enclosure (10); a tamper-detection sensor (40), which sensor (40) in turn comprises a tamper-detecting membrane (40) forming a sealed container in which the computer processor (30) is arranged, which membrane (40) is arranged on, and in direct thermal contact with, the said hollow metal body (20); and a metal heat sink structure (50) thermally connected to the computer processor (30), wherein the metal heat sink structure (50) is also arranged in direct thermal contact with a side of the membrane (40) not facing the said inside surface (22), so that the membrane (40) is sandwiched between the hollow metal body (20) and the metal heat sink structure (50) so that thermal connection is achieved between the metal heat sink structure (50) and the enclosure (10), via the membrane (40). The invention also relates to a method for manufacturing such a computer device.