Tamper-Proof Electronic Package Heat Transfer Element Integration
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Solution Overview
Problem
Tamper-proof electronic packages face challenges in heat dissipation as power dissipation increases, leading to elevated component temperatures, which can degrade performance and require enhanced thermal performance to meet growing electronic demands, while maintaining security and size constraints.
Innovation Solution
The implementation of a thermally conductive enclosure with heat transfer elements, such as copper or other high thermal conductivity materials, integrated with a thermal interface material to facilitate heat transfer from electronic components outwards through the enclosure, combined with a tamper-respondent sensor and encapsulant for security, ensures effective heat dissipation and tamper detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a tamper-proof electronic package with sealed enclosure is used, then security and tamper detection are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The enclosure is segmented into distinct thermal zones with dedicated heat transfer elements positioned at strategic locations. The thermally conductive cover is divided into multiple sections, each equipped with heat transfer elements that independently manage heat from different electronic components, allowing optimized thermal pathways without compromising security.
Solution Approach 2:
Heat transfer elements act as intermediary components between the electronic components and the thermally conductive cover. These intermediaries facilitate heat transfer from the sealed electronic components to the enclosure without requiring the enclosure itself to be thermally conductive, thus maintaining both security and heat dissipation.
2Power
If power dissipation of electronic components is increased, then performance is improved, but heat dissipation challenge increases
Solution Approach 1:
The thermal management system employs local quality by providing enhanced heat transfer capabilities at specific locations where high-power electronic components are mounted. Heat transfer elements are strategically positioned and sized according to the local heat generation density, with larger or more numerous elements placed near high-power components to efficiently dissipate their heat without affecting other areas of the enclosure.
3Temperature
If heat transfer elements are added to the enclosure, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat transfer elements are merged with the thermally conductive cover structure, eliminating the need for separate mounting brackets, adhesives, or fastening mechanisms. The elements are integrally formed or permanently attached during the enclosure manufacturing process, reducing assembly steps and structural complexity while maintaining effective thermal pathways.
Solution Approach 2:
The thermally conductive cover serves multiple functions: it provides structural support for the electronic components, acts as a heat sink, and serves as a mounting surface for the heat transfer elements. This multi-functionality reduces the need for additional components and simplifies the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation within tamper-proof electronic packages, maintaining performance and security levels, even in next-generation devices, by ensuring that heat is efficiently transferred outwards through the thermally conductive cover and encapsulant, while maintaining the integrity of the tamper-proof features.
Implementation Method 1
a heat transfer element is spaced from the respective electronic component, and a thermal interface material is disposed between and couples the heat transfer element and the respective electronic component to facilitate conductive transfer of heat from the respective electronic component to the thermally conductive cover of the enclosure through the heat transfer element
Data Source
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Figure 3A~3C
AI summary
Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.