Tamper-Respondent Sensor with Exposed Conductive Traces

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Solution Overview

Problem

Existing tamper-proof electronic packages face challenges in detecting and responding to unauthorized physical access, particularly in high-security applications where encryption/decryption modules need robust protection against intrusion and data erasure.

Innovation Solution

A tamper-respondent assembly is developed, featuring a multilayer circuit board with an embedded tamper-detect circuit and a tamper-respondent sensor with conductive traces in a specific pattern, which is encapsulated in a thermally conductive enclosure and adhesive, designed to detect and respond to tampering attempts by altering resistance and triggering data erasure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a tamper-detect circuit with conductive traces is placed at the enclosure-to-board interface, then tamper detection capability is improved, but the circuit becomes vulnerable to adhesive coverage that prevents proper detection

Engineering Contradiction:
Improvetamper detection capabilityVSAvoidcircuit trace accessibility
Core Design Contradiction:
ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent applies local quality by creating exposed regions and unexposed regions of the conductive traces at different locations. The exposed regions allow adhesive to contact the traces for mechanical bonding, while the unexposed regions remain accessible for electrical connection and tamper detection. This spatial differentiation of trace accessibility resolves the contradiction between needing adhesive coverage and maintaining detection capability.

Inventive Principle:
Principle #3Local quality

2Strength

If adhesive is applied to secure the sensor to the enclosure, then bonding strength is improved, but the adhesive may cover conductive traces and prevent electrical contact

Engineering Contradiction:
Improveadhesive bonding strengthVSAvoidelectrical connection reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent differentiates the enclosure edge surface into exposed regions where adhesive contacts conductive traces for bonding, and unexposed regions where traces remain accessible for electrical connection. This localized differentiation allows the adhesive to provide strong bonding without compromising electrical connection reliability.

Inventive Principle:
Principle #3Local quality

3Measurement precision

If the conductive trace pattern is made more complex to enhance detection, then detection precision is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvetamper detection precisionVSAvoidcircuit pattern complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses a relatively simple conductive trace pattern that extends across the enclosure edge surface, providing adequate tamper detection without excessive complexity. The design achieves sufficient detection precision through the strategic placement and configuration of traces in exposed and unexposed regions, rather than using overly complex patterns.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively enhances the security of encryption/decryption modules by ensuring immediate detection and erasure of sensitive information upon tampering, meeting high-security standards like NIST FIPS 140-2 Level 4 requirements, thereby protecting against unauthorized access.

Implementation Method 1

The tamper-respondent sensor includes exposed regions and unexposed regions of the at least one conductive trace at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS10798816B1Tamper detection at enclosure-to-board interface
Publication Date: 2020.10.06 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US10798816B1 patent drawing
  • US10798816B1 patent drawing
  • US10798816B1 patent drawing

AI summary

Tamper-respondent assemblies are provided which include an enclosure with an edge surface, and a tamper-respondent sensor. The tamper-respondent sensor covers, at least in part, the edge surface and an inner surface of the enclosure. The sensor includes at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern. The tamper-respondent sensor includes exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions.