Tamper Sensor Assembly with Folded Substrate for Hardware Enclosure
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Solution Overview
Problem
Existing tamper sensors in computing devices are vulnerable to physical attacks such as drilling, puncturing, and mechanical disassembly, which can bypass their protective zones, necessitating a tamper assembly that minimizes hardware access and is resistant to solvent-based attacks to achieve a Level 4 FIPS security rating.
Innovation Solution
A tamper sensor assembly featuring a substrate with a protective bulk section, hardware section, and attachment section, where the substrate is folded to enclose the hardware, incorporating tamper circuitry that alters the hardware's operation upon modification, and utilizing a flexible polyvinylidene fluoride film with adhesive and interlock mechanisms for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional tamper sensors are used with protective zones, then hardware security is provided, but physical attacks such as drilling, puncturing, and mechanical disassembly can bypass the protective zones
Solution Approach 1:
The substrate is divided into distinct functional sections: a protective bulk section containing tamper circuitry, a hardware section for hardware circuitry, and an attachment section. This segmentation allows each section to serve its specific security function while collectively providing comprehensive protection against physical attacks.
Solution Approach 2:
The hardware section is folded to enclose the hardware circuitry within the substrate structure, creating a nested configuration where the hardware is protected inside the folded substrate. This nesting provides mechanical protection and prevents direct access to the hardware components.
2Ease of operation
If hardware components are exposed for access, then operational functionality is maintained, but unauthorized physical access and tampering become possible
Solution Approach 1:
The substrate incorporates folds that allow it to transition between different configurations. The hardware section can be folded to enclose the hardware circuitry during operation, while still allowing for controlled access when needed. This dynamic structure provides both security and operational functionality.
Solution Approach 2:
The substrate itself acts as a flexible protective shell that can be folded and configured to enclose the hardware. This thin film structure provides protection while maintaining the ability to access hardware when required, balancing security and operational needs.
3Ease of manufacture
If the substrate structure is simplified for manufacturing, then production cost decreases, but resistance to solvent-based attacks and achievement of Level 4 FIPS rating is compromised
Solution Approach 1:
Multiple security functions are merged into a single substrate structure: tamper detection circuitry, hardware enclosure, and protective folding mechanisms are all integrated into one component. This merging provides high security functionality while maintaining manufacturing efficiency through consolidation rather than assembly of multiple separate parts.
Data Source
AI summary
A tamper sensor assembly that includes a substrate with a protective bulk section including tamper circuitry and a hardware section configured to receive hardware circuitry and extending from the protective bulk section; the hardware circuitry electrically connected to the tamper circuitry to alter operation of the hardware circuitry responsive to modification of the tamper circuitry. The substrate additionally includes an attachment section extending from the hardware section. The tamper sensor assembly also includes a first fold in the substrate to position a first portion of the hardware section to extend along the protective bulk section, and a second fold in the substrate to position a second portion of the hardware section to extend along the first portion of the hardware section.