Tamper Sensor Nanorod Integration

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Solution Overview

Problem

Existing tamper-responsive assemblies for secure electronic communications lack effective protection against physical tampering and reverse engineering, as they rely on discrete piezoelectric sensors with limited sensing areas and higher manufacturing costs.

Innovation Solution

Integration of a piezoelectric sensor with a plurality of nanorods into a tamper-responsive assembly, where the sensor is fabricated using a low-temperature chemical growth process and deposited on a conductive layer within an enclosure, enhancing sensing area and security while reducing costs through efficient manufacturing methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If discrete piezoelectric sensors are used in tamper-responsive assemblies, then the assembly provides basic tamper detection capability, but the sensing area is limited and manufacturing costs are higher

Engineering Contradiction:
Improvesensing areaVSAvoidmanufacturing cost
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The piezoelectric sensing layer is segmented into multiple independent nanorod structures that can be independently formed and controlled. Each nanorod acts as an independent sensing element, allowing the sensing area to be expanded by adding more nanorods without proportionally increasing complexity or cost

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the physical parameters of the piezoelectric material from bulk or discrete sensor forms to nanoscale rod structures. This parameter change enables larger sensing areas to be covered with the same material quantity, reducing material costs while expanding the sensing footprint

Inventive Principle:
Principle #35Parameter changes

2Productivity

If discrete piezoelectric sensors are used in tamper-responsive assemblies, then the assembly provides basic tamper detection capability, but the manufacturing process is less efficient and more costly

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The invention merges the piezoelectric material deposition with the existing PCB fabrication process by applying the piezoelectric layer as a coating on the copper trace layer. This consolidation eliminates separate manufacturing steps, improving productivity and reducing overall manufacturing cost

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The nanorod structures are formed through self-organization during the deposition process, where the material automatically forms the desired nanorod morphology without requiring complex lithography or patterning steps. This self-organizing behavior simplifies the manufacturing process and reduces costs

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated piezoelectric sensor provides enhanced security by effectively detecting physical tampering and reducing false alarms, safeguarding sensitive data and circuitry, and facilitating cost-efficient and reliable fabrication.

Implementation Method 1

a piezoelectric layer (223) comprising a plurality of nanorods (225)

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

growing the plurality of nanorods on the first structure comprises a chemical growth process

Methodology Applied
Scientific EffectChemical growth: Chemical Bonding

Data Source

PatentUS11191154B2Enclosure with tamper respondent sensor
Publication Date: 2021.11.30 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US11191154B2 patent drawing
  • US11191154B2 patent drawing
  • US11191154B2 patent drawing

AI summary

A method to fabricate a tamper respondent assembly is provided. The tamper respondent assembly includes an electronic component and an enclosure at least partly enclosing the electronic component. A piezoelectric sensor is integrated in the enclosure. The integrating includes providing a base structure that includes a first conductive layer, depositing a piezoelectric layer on the first conductive layer, covering the piezoelectric layer with a second conductive layer, and providing sensing circuitry for observing sensing signals of the piezoelectric layer. The piezoelectric layer includes a plurality of nanorods. Aspects of the invention further relates to a corresponding assembly and a corresponding computer program product.