3D Tamper-Respondent Sensor with Random Security Patterns

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Solution Overview

Problem

Existing tamper-proof electronic assemblies are vulnerable to unauthorized access due to the susceptibility of their security meshes to bending and stretching, which can compromise the security circuit, and the similarity of their circuit patterns makes it possible to gain access to encryption/decryption keys without triggering erasure of secure information.

Innovation Solution

A method is developed to create a tamper-respondent sensor with a random, three-dimensional security pattern within a secure volume, using conductive traces that are difficult to breach undetected, and ensuring each sensor has a unique pattern to prevent unauthorized access, by generating trace configurations that meet specific security requirements and are distinct from other sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional security mesh is used, then the sensor can detect tampering, but the mesh is susceptible to bending and stretching which compromises security

Engineering Contradiction:
Improvetamper detection reliabilityVSAvoidsecurity circuit integrity
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent transitions from a two-dimensional planar mesh to a three-dimensional security pattern. The conductive traces are arranged in multiple layers and orientations within a volumetric sensor structure, creating a spatially distributed security circuit that resists bending and stretching while maintaining tamper detection capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The sensor employs a composite structure combining conductive traces with a three-dimensional matrix or embedding material. This composite construction provides mechanical stability to the security circuit while maintaining its electrical connectivity and tamper detection function.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If identical circuit patterns are used across sensors, then manufacturing is simplified, but unauthorized access to encryption keys becomes possible through pattern replication

Engineering Contradiction:
Improvecircuit pattern fabricationVSAvoidsecurity against unauthorized access
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces local variability in the security circuit pattern while maintaining consistent manufacturing processes. Each sensor contains a unique arrangement of conductive traces within the three-dimensional space, creating localized differences that prevent pattern replication attacks while using standardized fabrication techniques.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention varies the spatial parameters of the security circuit, such as trace positions, orientations, and layer configurations, to create unique patterns for each sensor. These parameter variations are introduced through controlled randomization or encoding during the manufacturing process, ensuring both ease of production and security uniqueness.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If conductive traces are arranged in a simple pattern, then manufacturing precision requirements are reduced, but the security circuit becomes easier to breach

Engineering Contradiction:
Improvetrace fabrication toleranceVSAvoidsecurity circuit breach resistance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

By distributing conductive traces across three-dimensional space with multiple layers and varied orientations, the patent increases the complexity of potential breach paths. This volumetric arrangement requires an attacker to navigate through multiple layers and directions, significantly increasing the difficulty of undetected tampering while maintaining reasonable manufacturing tolerances.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11877390B2Fabricating tamper-respondent sensors with random three-dimensional security patterns
Publication Date: 2024.01.16 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US11877390B2 patent drawing
  • US11877390B2 patent drawing
  • US11877390B2 patent drawing

AI summary

Methods of fabricating tamper-respondent sensors with random three-dimensional security patterns are provided. The methods include establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume. The establishing includes determining in three-dimensions boundaries for the security circuit of the tamper-respondent sensor. The boundaries define a sensor volume which the security circuit is to fill in three dimensions. The establishing also includes generating at least one trace configuration for the security circuit pattern. The at least one trace configuration defines a random, three-dimensional security pattern to fill the sensor volume, and the at least one trace configuration establishes, at least in part, the security circuit pattern. The process further includes fabricating the tamper-respondent sensor based on the established security circuit pattern.