Tandem Photovoltaic Interlayer Structure for Optical Isolation

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Solution Overview

Problem

Tandem photovoltaic devices face challenges in achieving desired electrical, optical, physical, and thermal properties, particularly in the interlayer structure between submodules, which affects their efficiency and manufacturability.

Innovation Solution

A multilayered interlayer structure comprising a core layer with a high melting point and conformal layers with low melting points is used, allowing for efficient light transmission and minimizing voids between submodules, while maintaining dielectric resistance and adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-layer interlayer structure is used, then the device structure is simple, but it cannot simultaneously achieve desired dielectric resistance, optical transmission, and thermal stability

Engineering Contradiction:
Improveinterlayer structureVSAvoiddielectric resistance and optical performance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The interlayer is divided into three distinct functional layers: a first conformal layer for adhesion and surface conforming, a core layer for dielectric resistance and thermal stability, and a second conformal layer for optical matching and void minimization. This segmentation allows each layer to be optimized for its specific function, resolving the contradiction between structural simplicity and performance reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interlayer uses composite material construction with polymers of different melting points and properties in each layer. The core layer employs high-melting-point polymer for thermal stability, while conformal layers use lower-melting-point polymers for adhesion and optical properties. This composite approach enables simultaneous achievement of dielectric resistance, optical transmission, and thermal stability that a single material cannot provide.

Inventive Principle:
Principle #40Composite materials

2Temperature

If high-melting-point polymer is used throughout the interlayer, then thermal stability is improved, but adhesion and void minimization become difficult

Engineering Contradiction:
Improvethermal stabilityVSAvoidadhesion and void minimization
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

Different regions of the interlayer are assigned different material properties: the core layer uses high-melting-point polymer for thermal stability, while the conformal layers use lower-melting-point polymers optimized for adhesion and optical conforming. This local differentiation of material quality allows each region to perform its specific function optimally without compromising overall performance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The melting point parameter of the polymer is varied across different layers of the interlayer. The core layer maintains high melting point for thermal stability, while the conformal layers use materials with lower melting points that facilitate better adhesion and void minimization during manufacturing. This parameter change strategy resolves the contradiction between thermal stability and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If low-melting-point polymer is used throughout the interlayer, then adhesion and conforming are improved, but dielectric resistance and thermal stability deteriorate

Engineering Contradiction:
Improveadhesion and conformingVSAvoiddielectric resistance and thermal stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The interlayer is segmented into core and conformal layers with distinct material properties. The conformal layers use low-melting-point polymers for excellent adhesion and surface conforming, while the core layer uses high-melting-point polymer for dielectric resistance and thermal stability. This segmentation allows low-melting-point materials to be used where adhesion is critical without compromising overall thermal and electrical performance.

Inventive Principle:
Principle #1Segmentation

4Ease of manufacture

If the interlayer does not conform well to submodule surfaces, then manufacturing is easier, but optical transmission efficiency and electrical performance deteriorate

Engineering Contradiction:
Improveinterlayer assemblyVSAvoidoptical transmission efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The conformal layers are designed as thin film structures that can flex and conform to the surface topology of the submodules. These thin films achieve complete surface coverage and adhesion while maintaining optical transparency, enabling good optical transmission efficiency without complex manufacturing processes. The thin film nature allows easy integration into the manufacturing workflow.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The interlayer structure enhances the optical interface, prevents shorting, and maintains dielectric breakdown distance, leading to improved efficiency and reliability of tandem photovoltaic devices across a wide temperature range.

Implementation Method 1

A photovoltaic device generates electrical power by converting light into electricity using semiconductor materials that exhibit the photovoltaic effect

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Implementation Method 2

The first conformal layer can include a first polymer having a melting point less than about 170 degrees C. The second conformal layer can include a second polymer having a melting point less than about 170 degrees C

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS20240421237A1Materials and Methods for Tandem Photovoltaic Devices
Publication Date: 2024.12.19 FIRST SOLAR INC
  • US20240421237A1 patent drawing
  • US20240421237A1 patent drawing
  • US20240421237A1 patent drawing

AI summary

Structures and methods for making and using tandem photovoltaic devices are provided, where such devices can include a first submodule, a second submodule, and an interlayer disposed between the first submodule and the second submodule. The interlayer permits a portion of light to pass therethrough and includes first and second conformal layers along with a core layer. The first conformal layer directly contacts and conforms to a surface of the first submodule, the second conformal layer directly contacts and conforms to a surface of the second submodule, and the core layer is disposed between the first conformal layer and the second conformal layer.