Tandem Rolling LED Packaging with Organic Silicone Resin
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Solution Overview
Problem
Existing LED packaging methods using organic silicone resin photoconverters face issues such as pores, unequal thickness, and low production efficiency, leading to reduced luminous efficacy and high product costs, due to thermal overstress and complex processes.
Innovation Solution
A process method for bond-packaging LEDs using an organic silicone resin photoconverter by tandem rolling, involving semi-cured photoconversion sheet preparation, pseudo-curing, dual-roller roll-bonding, and curing, which eliminates flaws and ensures uniform thickness and brightness, enhancing production efficiency and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If screen printing process is used to coat photoconverter, then coating uniformity is improved, but thermal overstress causes pores and surface defects
Solution Approach 1:
The patent replaces the screen printing mechanical process with a tandem rolling mechanical process that uses rollers to apply and smooth the photoconverter material. This mechanical substitution eliminates the thermal curing step that causes pores and surface defects, while still achieving uniform coating through the rolling action and pressure application.
Solution Approach 2:
The patent changes the processing parameters by using room temperature or low temperature rolling instead of high temperature curing. The photoconverter material is applied in a semi-cured state and then finished at lower temperatures, fundamentally changing the thermal parameters to avoid thermal overstress damage.
2Strength
If thermal curing is applied to cure photoconverter and silica gel, then bonding strength is improved, but thermal overstress reduces LED luminous efficacy
Solution Approach 1:
The patent performs preliminary bonding actions at room temperature or low temperature using the tandem rolling process before any thermal curing. The photoconverter is applied and initially bonded without thermal overstress, and curing is either avoided or performed at much lower temperatures, thus preserving LED luminous efficacy while still achieving adequate bonding strength.
Solution Approach 2:
The patent substitutes mechanical rolling and pressure application for thermal curing as the primary bonding mechanism. The tandem rolling process uses mechanical pressure and friction to bond the photoconverter to the LED chip, eliminating or reducing the need for high temperature thermal curing that damages LED performance.
3Reliability
If complex packaging procedures are used, then bonding reliability is improved, but production efficiency decreases
Solution Approach 1:
The patent merges multiple separate packaging steps into a single tandem rolling operation. The coating, smoothing, and initial bonding steps that were previously separate processes are combined into one continuous rolling pass, significantly reducing the number of steps and improving production efficiency while maintaining bonding reliability.
Solution Approach 2:
The tandem rolling process creates a continuous operation where the photoconverter material is continuously applied, smoothed, and bonded in one uninterrupted flow. This eliminates the start-stop nature of multiple discrete steps, maintaining continuous productive action and greatly enhancing production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves the yield and luminous efficacy of LEDs by eliminating pores and crests, achieving uniform thickness and brightness, and simplifying the packaging process, making it suitable for industrialized batch production.
Implementation Method 1
a photoconverter layer configured on a surface of the support chip in the through-thickness direction in the same manner as LED configuration, the photoconverter layer being formed by active energy ray cured resin which is cured by irradiation with an active energy ray
Implementation Method 2
curing of LED package elements, where the process includes the following basic steps: step 1: preparation of a semi-cured photoconversion sheet
Data Source
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AI summary
Provided is a process method for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling, including the following continuous process flow: preparation of a semi-cured photoconversion sheet, pseudo-curing of the semi-cured photoconversion sheet, preparation of a flip chip LED array sheet, forming of LED package elements by dual-roller roll-bonding, curing of the LED package elements, and cutting of the LED package elements. The present invention has a significant advantage of bond-packaging an LED by using a continuous rolling process, and can satisfy a condition requirement of bond-packaging an LED using an organic silicone resin photoconverter, thereby improving the production efficiency and yield of LED packages in industrialized batch production.