Circuit Board Ventilation Using Tangential Air Streams

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Solution Overview

Problem

Existing ventilation devices for circuit boards, particularly in computers, have a large height relative to the board, making them problematic in compact spaces and challenging to install, especially when temperature-sensitive components like hard drives are involved, as they often rely on natural convection which is stretched to its limits.

Innovation Solution

A ventilation device design featuring two fans placed next to the circuit board with their axes perpendicular to the board's plane, directing air streams tangentially over both sides using air guide elements, allowing for efficient two-sided ventilation with minimal device height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional ventilation devices are used with large height, then effective ventilation can be achieved, but the device becomes problematic in compact spaces and difficult to install

Engineering Contradiction:
Improveventilation effectivenessVSAvoiddevice height
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent changes the ventilation approach from vertical (top-to-bottom) to horizontal (side-to-side) by placing fans perpendicular to the circuit board plane. This dimensional transformation allows ventilation to occur along the board's edges rather than requiring significant vertical space, thus reducing device height while maintaining ventilation effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The ventilation system is divided into multiple independent fan units positioned at different locations along the circuit board edges. Each fan creates localized air currents that flow along specific segments of the board, enabling distributed ventilation across the entire board surface without requiring a single large vertical structure.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If natural convection is used, then device complexity is reduced, but ventilation is stretched to its limits in compact spaces

Engineering Contradiction:
Improveventilation system complexityVSAvoidventilation capacity
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent employs fans that can dynamically adjust their operation based on thermal conditions. The fans are positioned to create forced convection currents that actively respond to heat generation, providing enhanced ventilation capacity when needed while maintaining manageable system complexity through controlled mechanical assistance rather than passive reliance on natural convection.

Inventive Principle:
Principle #15Dynamics

3Area of stationary object

If multiple cards are inserted into connector strips with small distances, then space utilization is improved, but ventilation becomes problematic

Engineering Contradiction:
Improvespace utilizationVSAvoidcomponent temperature control
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent implements localized ventilation by positioning fans and air guide elements at specific locations along the circuit board edges. Each fan creates targeted air currents that flow along specific segments of the board, providing differentiated ventilation coverage to different regions. This local化的 approach ensures adequate cooling for components in dense configurations without requiring increased overall spacing.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables effective two-sided ventilation of circuit boards, maintaining a uniform temperature profile and reducing the overall height of the ventilation system, thus addressing the limitations of prior art in compact spaces.

Implementation Method 1

a first cooling air stream (5) from a first fan (12) and to generate a second cooling air stream (7) from a second fan (13)... the air currents from the fan flow over the circuit board's plane and are directed by appropriate air guide elements such that a stream of air flows largely tangentially over each side of the circuit board

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Data Source

PatentUS11630493B2Ventilation device
Publication Date: 2023.04.18 UNIFY BETEILIGUNGSVERWALTUNG GMBH & CO KG
  • US11630493B2 patent drawing
  • US11630493B2 patent drawing
  • US11630493B2 patent drawing

AI summary

A ventilation device (1) is proposed, in particular designed to ventilate a circuit board (2), preferably in or for a computer, wherein the ventilation device (1) is designed to produce a first cooling air stream (5) from a first fan (12) and to produce a second cooling air stream (7) from a second fan (13), wherein the first cooling air stream (5) and the second cooling air stream (7) flow through on different sides of an air stream boundary plane (L), preferably parallel to the air stream boundary plane (L), through a common ventilation plane (BL) perpendicular to the air stream boundary plane (L), wherein the directions of flow from the first fan (12) and the second fan (13) are crosswise to the air stream boundary plane (L), wherein the ventilation device (1) preferably is designed to be mountable such that the air stream boundary plane (L) coincides with a central plane of the circuit board.