Tangential Laser Cable Layer Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for cutting and removing layers of coaxial cables, particularly μ-coaxial cables, often damage or deform underlying layers due to mechanical stress or unwanted energy input from cutting tools like knives and lasers, which can lead to signal interference and structural impairment.
Innovation Solution
A method and device utilizing a laser cutting technique where the laser beam is aligned tangentially to the outer layer of the cable, with specific absorption properties allowing it to target and remove individual layers without affecting underlying layers, using high absorption in one layer and low absorption in the next, and rotating the cable to ensure precise removal without mechanical deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a knife is used to cut cable layers, then the cutting process is simple and mechanical, but the underlying layers are damaged or deformed due to penetrating or crushing forces
Solution Approach 1:
The patent replaces the mechanical knife cutting system with a laser-based optical system. The laser beam is directed tangentially to the cable surface, allowing non-contact cutting that eliminates mechanical crushing forces. This substitution enables precise layer removal while preserving the integrity of underlying layers, directly resolving the contradiction between cutting simplicity and layer integrity.
2Ease of operation
If laser cutting with mirrors and rotating optics is used, then cutting can be performed remotely, but the laser energy directly or indirectly affects underlying layers causing unwanted deformations
Solution Approach 1:
The patent applies local quality by directing the laser beam tangentially to the cable surface, creating a localized interaction zone that is confined to the outer layer. The tangential incidence angle ensures that laser energy is concentrated on the target layer while minimizing penetration into underlying layers. This localized energy delivery resolves the contradiction by enabling remote operation without causing widespread thermal damage.
Solution Approach 2:
The patent uses partial action by applying laser energy only to the specific layer that needs removal, rather than irradiating all layers equally. The tangential beam direction and controlled energy parameters ensure that only the outer layer receives sufficient energy for cutting, while underlying layers receive minimal or no energy, preventing unwanted deformations.
3Productivity
If the laser beam is directed onto the central axis of the cable, then the cutting process is straightforward, but energy is input into several layers simultaneously causing damage and deformation
Solution Approach 1:
The patent introduces asymmetry by directing the laser beam at a tangential angle rather than symmetrically along the central axis. This asymmetric incidence creates a localized energy deposition zone at the cable periphery, confining the cutting action to the outer layer. The asymmetric beam direction prevents energy from penetrating deeply into the cable core, thereby eliminating multi-layer damage while maintaining cutting efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the precise and damage-free removal of cable layers, minimizing interference and ensuring even cut edges, which is particularly advantageous for thin μ-coaxial cables where mechanical processing is challenging, and reduces thermal effects that could impact signal transmission.
Implementation Method 1
The laser beam is aligned tangentially to the outer layer of the cable, with specific absorption properties allowing it to target and remove individual layers without affecting underlying layers
Implementation Method 2
the laser beam has high absorption in one layer and low absorption in the next
Data Source
Figure 1
Figure 2a
Figure 2b
AI summary
The present invention relates to a method for cutting and/or ablating layers of a cable (1), the method comprising the following steps: generating a first laser beam (17), aligning the first laser beam (17) so that the first laser beam (17) forms a passant to the cable (1), moving the first laser beam (17) in the direction of the central axis (M) of the cable (1) to a first layer boundary point (P1) between a third and a second layer (8, 6) of the cable (1), wherein the first laser beam (17) exhibits high absorption in the third layer (8) and low absorption in the second layer (6), and rotating the cable (1) in a first direction of rotation (DR1) about the central axis (M) of the cable (1). The present invention also relates to a device for carrying out the method.