Tantalum Capacitor Array with Fixing Member for Compact High-Capacity Design
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Solution Overview
Problem
Tantalum capacitors face challenges in achieving high capacity while maintaining a compact size, as increasing product size complicates the formation of a semi-finished device and uniform cathode layer within porous products.
Innovation Solution
A capacitor array with a fixing member supporting tantalum capacitors, featuring a horizontal and vertical structure to maintain compactness, and conductive adhesive layers to enhance connectivity and reduce surface resistance, along with a frameless structure to increase contact area and capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the overall size of the tantalum capacitor is increased to achieve high capacity, then the capacitance increases, but the difficulty of forming a semi-finished device and uniform cathode layer increases
Solution Approach 1:
The capacitor is divided into multiple smaller capacitor units arranged in an array configuration. Each unit has its own cathode layer formed independently, avoiding the difficulty of forming uniform cathode layers in large single capacitors. The segmentation allows high total capacitance while maintaining manufacturability of individual units.
Solution Approach 2:
The invention transitions from a single large capacitor to a two-dimensional array of multiple smaller capacitors. This dimensional change allows the total capacitance to scale with the number of units while each unit remains small enough for uniform cathode layer formation and easy semi-finished device processing.
2Quantity of substance
If the product size is increased to achieve high capacity, then the capacitance increases, but the total size of the product increases significantly
Solution Approach 1:
Multiple small capacitor units are arranged in a compact array pattern, allowing the total capacitance to be the sum of individual units while the overall footprint remains small. The segmented design enables high capacitance density within a limited area.
Solution Approach 2:
Multiple capacitor units are merged into a single array structure with shared terminals and common cathode connections. This combining approach achieves high total capacitance without proportionally increasing the product size, as the units share common structural elements and connection paths.
3Reliability
If the contact area between adjacent tantalum capacitors is increased to reduce surface resistance, then the connectivity improves, but the structural complexity increases
Solution Approach 1:
Adjacent capacitor units share common cathode layers and terminal structures, creating large contact areas between units. This merging approach reduces surface resistance and improves connectivity while avoiding the need for complex individual connection structures for each unit.
Solution Approach 2:
The shared cathode layers and terminal structures serve multiple functions: they act as electrical connections for adjacent units, provide mechanical support, and reduce surface resistance. This multi-functionality improves reliability without adding structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-capacity tantalum capacitors with reduced ESR and surface resistance, maintaining a compact product size by optimizing the arrangement and connectivity of tantalum capacitors within the capacitor array.
Implementation Method 1
A tantalum oxide (Ta2O5) is formed using an anodic oxidation method on a surface of tantalum
Implementation Method 2
conductive adhesive layers to enhance connectivity and reduce surface resistance
Data Source
AI summary
An electronic component includes: a capacitor array including a plurality of tantalum capacitors arranged linearly; and a fixing member supporting a first surface and both side surfaces of the capacitor array so that the plurality of tantalum capacitors are not separated, wherein an area through which adjacent tantalum capacitors in the capacitor array are in contact with each other is 90% or more of an entire area of a corresponding surface of the adjacent tantalum capacitors.