Tape Carrier Package Heat Dissipation Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional tape carrier packages face challenges in effective heat dissipation due to insufficient heat conduction between semiconductor devices and secondary conductor patterns, especially with increased channel outputs and narrower pitches, leading to reduced heat dissipation efficiency and potential manufacturing cost increases.
Innovation Solution
The design incorporates heat dissipating electrode patterns on the semiconductor device's peripheral portions, electrically and thermally connected to conductive heat dissipation patterns on the tape carrier, ensuring secure connections and increased surface area for heat dissipation without adding thickness or requiring additional manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If second conductor patterns are formed on blank areas to increase surface area for heat dissipation, then the surface area of conductor patterns is increased, but heat conduction from semiconductor device becomes insufficient due to lack of secure connection
Solution Approach 1:
The patent merges the signal transmission function and heat dissipation function into a single integrated conductor pattern structure. The conductor patterns are designed to simultaneously serve as signal pathways and heat dissipation pathways, eliminating the need for separate heat dissipation structures and achieving secure thermal connection through the same bonding interfaces used for electrical connection.
Solution Approach 2:
The conductor patterns are designed to perform multiple functions: signal input/output and heat dissipation. By making the conductor patterns multi-functional, the patent achieves both electrical connectivity and thermal connectivity through the same structural elements, thereby improving heat conduction efficiency without adding separate components.
2Reliability
If additional steps are added to ensure thermal connection between semiconductor device and second conductor pattern, then heat conduction becomes sufficient, but manufacturing cost increases
Solution Approach 1:
The patent combines the electrical bonding and thermal bonding processes into a single integrated bonding step. The same bonding material and bonding conditions that ensure electrical connection also ensure thermal connection, eliminating the need for additional thermal bonding steps and reducing manufacturing complexity and cost.
Solution Approach 2:
The conductor patterns are designed to automatically provide both electrical and thermal connection functions through their inherent structure and material properties. The bonding process that establishes electrical connectivity inherently establishes thermal connectivity as well, allowing the structure to serve its own thermal management needs without requiring separate intervention or additional components.
3Productivity
If electrodes are disposed at end portions for multi-channel configuration, then number of outputs increases, but conductor pattern for heat dissipation cannot be disposed
Solution Approach 1:
The patent segments the conductor patterns into multiple distributed pathways that extend from different regions of the semiconductor device. By creating multiple separate conductor pattern pathways rather than relying on a single large pattern, the design can accommodate end-portion electrode placement while still providing sufficient total surface area for heat dissipation through the combined effect of multiple segments.
Solution Approach 2:
The patent utilizes the full two-dimensional plane of the tape carrier by extending conductor patterns in multiple directions and utilizing vertical layering where applicable. This multi-dimensional arrangement of conductor patterns maximizes the use of available space, allowing heat dissipation pathways to be created even when electrode placement at end portions constrains traditional layout options.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency by securing connections between heat dissipation patterns and semiconductor devices, reducing thermal resistance by approximately 20% without increasing the tape carrier package's thickness or requiring additional manufacturing steps.
Implementation Method 1
heat dissipation patterns which are electrically and thermally connected to heat dissipating electrode patterns of the semiconductor device
Data Source
AI summary
A semiconductor device on a tape carrier package with improved heat dissipation, as provided. The number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration, and narrower pitches are employed. Included are a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns 25 to 27 are formed. The heat dissipation patterns have a surface area broader than that of the lead patterns and have the heat dissipating electrode patterns disposed thereon.