Tape Carrier Package Recessed Substrate for LCD Lead Protection

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Solution Overview

Problem

Conductive leads in tape carrier packages for liquid crystal display panels tend to bend during assembly, leading to open lines and connectivity issues due to external impacts, despite existing protective measures.

Innovation Solution

A tape carrier package design featuring a flexible substrate with recessed end portions and pin-like contact arrays formed by conductive leads between these recesses, which are connected to an integrated circuit and protected from impact by the recesses, preventing bending and ensuring reliable connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If corner portions of the substrate directly connect to contact portions of the leads, then the structure is simple and easy to manufacture, but the contact portions are indirectly affected by external impacts on the corner portions, causing bending and open lines

Engineering Contradiction:
Improvestructural simplicityVSAvoidlead connection reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The substrate is segmented by introducing recesses that divide the substrate into distinct regions. The contact portions of the leads are positioned within recesses rather than at the extreme corners, effectively segmenting the force transmission path and isolating the contact portions from direct impact forces on the substrate corners.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The recesses act as pre-designed cushioning structures that absorb and distribute external impact forces before they can reach the contact portions of the leads. By positioning contact portions within recesses, the design beforehand prepares protective geometry that cushions against bending forces during assembly and operation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Ease of operation

If the contact portions are positioned at the periphery of the substrate for electrical connection, then electrical connectivity is achieved, but the contact portions are exposed to external impacts during assembly, causing bending and open lines

Engineering Contradiction:
Improveelectrical connection capabilityVSAvoidexternal impact damage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The contact portions of the leads are nested within the recesses of the substrate, creating a protective enclosure. This nesting structure allows the contact portions to maintain their peripheral positioning for electrical connection while being physically protected from external impacts by the surrounding recess geometry.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The recesses serve as intermediary structures between the substrate corners and the contact portions of the leads. They mediate the transmission of external forces, providing a protective buffer zone that allows electrical connection functionality while reducing direct exposure to harmful impact forces.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS7463326B2Tape carrier package and liquid crystal display panel
Publication Date: 2008.12.09 NYTELL SOFTWARE LLC
  • US7463326B2 patent drawing
  • US7463326B2 patent drawing
  • US7463326B2 patent drawing

AI summary

A tape carrier package includes: a flexible substrate having an end portion that is formed with two recesses spaced apart from each other; a plurality of conductive leads provided on the flexible substrate in a manner to form a pin-like contact array on the end portion of the flexible substrate between the recesses in the end portion of the flexible substrate; and an integrated circuit provided on the flexible substrate and coupled to the conductive leads. A liquid crystal display panel includes: a panel body having a contact region; a driver printed circuit board; and a plurality of the aforesaid tape carrier packages. The pin-like contact array of the conductive leads on the end portion of the flexible substrate is connected to the contact region of the panel body and the driver printed circuit board.